Hostname: page-component-76fb5796d-9pm4c Total loading time: 0 Render date: 2024-04-25T23:05:51.881Z Has data issue: false hasContentIssue false
  • English
  • Français

Experimental Evaluation of Mechanical Behavior of GaAs Wafer Material

Published online by Cambridge University Press:  26 February 2011

Jun Ming Hu ,
Michael Pecht  and
Donald Barker
Jun Ming Hu
Affiliation:
CALCE Center For Electronics Packaging, University of Maryland, College Park, MD 20742
Michael Pecht
Affiliation:
CALCE Center For Electronics Packaging, University of Maryland, College Park, MD 20742
Donald Barker
Affiliation:
CALCE Center For Electronics Packaging, University of Maryland, College Park, MD 20742
Get access

Abstract

The mechanical behavior of non-metalized GaAs wafer material at different temperatures were evaluated. The material properties of GaAs, including the modulus of elasticity, the modulus of rupture, the critical value of stress intensity factor, and the coefficient of thermal expansion, were experimentally determined over various temperature ranges.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 141
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Swaminathan, V. and Copley, S.M., J. of American Ceramic Society, 58, 482 (1975).Google Scholar
2. Laister, D. and Jenkins, G.M., J. of Material Science, 8. 1218 (1973).Google Scholar
3. Yonenaga, I., Onose, U., and Sumino, K., J. Mater. Res., 2, 252 (1987).Google Scholar
4. Chen, C.P., NASA Tech Brief, 13, No.8, Item #60, from JPL Invention Report NPO-17637/7135 (1989).Google Scholar
5. Chen, C.P., Final Report, JPL Publication 84-81, Jet Propulsion Laboratory, California, (1984).Google Scholar
6.ASTM E-399, Annual Book of ASTM Standards, Vol. 03.01, ASTM, Philadelphia, (1990).Google Scholar
7. Chen, C.P. and Leipold, M.H., American Ceramic Society Bulletin, 59, 469 (1980).Google Scholar