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Fabrication, Performance, and Reliability of InP-Based HBTs

Published online by Cambridge University Press:  22 February 2011

William E. Stanchina
Affiliation:
Hughes Research Laboratories, 3011 Malibu Canyon Rd., Malibu, CA 90265
Robert A. Metzger
Affiliation:
Hughes Research Laboratories, 3011 Malibu Canyon Rd., Malibu, CA 90265
Joseph F. Jensen
Affiliation:
Hughes Research Laboratories, 3011 Malibu Canyon Rd., Malibu, CA 90265
Madjid Hafizi
Affiliation:
Hughes Research Laboratories, 3011 Malibu Canyon Rd., Malibu, CA 90265
David B. Rensch
Affiliation:
Hughes Research Laboratories, 3011 Malibu Canyon Rd., Malibu, CA 90265
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Abstract

Over the past 10 years, heterojunction bipolar transistors (HBTs) have progressed to where integrated circuit (IC) products are being sold and foundry services are being commercially offered utilizing gallium arsenide (GaAs) based technology. We will discuss, here, an alternative HBT technology based on indium phosphide (InP). While this technology is less mature than its GaAs counterpart, it offers several attractive benefits in comparison with GaAs. These benefits are provided through several key material properties of InP and ternary compound semiconductors, eg. gallium indium arsenide (GaInAs), grown on the InP. We review the status of this npn HBT technology and present performance results which illustrate the benefits of the technology with respect to electronic applications. Finally, we present measured reliability data for this technology which shows outstanding projected lifetimes.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

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References

REFERENCES

1. Malik, R.J., Hayes, J.R., Capasso, F., Alavi, K., and Cho, A.Y., IEEE Electron Device Lett. EDL–4, 383 (1983).Google Scholar
2. Kanbe, H., Vlcek, K., and Fonstad, C.G., IEEE Electron Device Lett. EDL–5, 172 (1984).Google Scholar
3. Nottenburg, R.N., Temkin, H., Panish, M.B., Bhat, R., and Bischoff, J.C., IEEE Electron Device Lett. EDL–7, 643 (1986).Google Scholar
4. Chen, Y.K., Nottenburg, R.N., Panish, M.B., Hamm, R.A., and Humphrey, D.A., IEEE Electron Device Lett. 10, 267 (1989).Google Scholar
5. Hafizi, M., Jensen, J.F., Metzger, R.A., Stanchina, W.E., and Rensch, D.B., IEEE Electron Device Lett. 12, 612 (1992).Google Scholar
6. Feygenson, A., Hamm, R.A., Smith, P.R., Pinto, M.R., Montgomery, R.K., Yadvish, R.D., and Temkin, H., Tech. Dig. 1992 Intern. Electron Devices Mtg., 75 (1992).Google Scholar
7. Stanchina, W.E., Jensen, J.F., Metzger, R.A., Hafizi, M., and Rensch, D.B., Proc. 4th Intern. Conf. on Indium Phosphide and Related Materials (Newport, RI), 434 (1992).Google Scholar
8. Gao, G.B. and Morkoc, H., IEEE Trans. Electron Devices 38, 2410 (1991).Google Scholar
9. Early, J.M., Proc. IRE 46, 1924 (1958).Google Scholar
10. Hafizi, M., Stanchina, W.E., Metzger, R.A., Jensen, J.F., Rensch, D.B., Delaney, M.J., Greiling, P.T., and Williams, F., Tech. Dig. 1992 Intern. Electron Devices Mtg., 71 (1992).Google Scholar
11. Metzger, R.A., Hafizi, M., Wilson, R.G., Stanchina, W.E., Jenson, J.F., and McCray, L.G., J.. Vac. Sci. Technol. B 10, 2347 (1992).Google Scholar
12. Jensen, J.F., Hafizi, M., Stanchina, W.E., Metzger, R.A., and Rensch, D.B., Proc. 1992 GaAs IC Symp., 101 (1992).x Google Scholar
13. Farley, C.W., Wang, K.C., Chang, M.F., Asbeck, P.M., Nubling, R.B., Sheng, N.H., Pierson, R., and Sullivan, G.J., IEEE Electron Device Lett. 10, 377 (1989).Google Scholar
14. Kurisu, M., Sasayama, Y., Ohuchi, M., Sawairil, A., Takemura, H., and Tashiro, T., Intern. Solid-State Circuits Conf. Digest of Technical Papers, 158, (1991).Google Scholar
15. Mishra, U.K., Jensen, J.F., Brown, A.S., Thompson, M.A., Jelloian, L.M., and Beaubien, R.S., IEEE Electron Device Lett. 9, 482 (1988).Google Scholar
16. Asai, K., and Ishibashi, T., presented at the 1989 Picosecond Electronics and Optoelectronics Topical Meeting.Google Scholar
17. Yamauchi, Y., Nakajima, O., Nagata, K., Ito, H., and Ishibashi, T., Proc. 1989 GaAs IC Symposium, 121 (1989).Google Scholar
18. Jensen, J.F., Stanchina, W.E., Metzger, R.A., Liu, T., Kargodorian, T.V., Pierce, M.W., and McCray, L.G., 1991 Device Research Conf. (Boulder, CO) (1991).Google Scholar
19. Jensen, J.F., Stanchina, W.E., Metzger, R.A., Rensch, D.B., Lohr, R.F., Quen, R.W., Pierce, M.W., Allen, Y.K., and Lou, P.F., IEEE J. Solid-State Circuits 26, 415 (1991).Google Scholar