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Fracture Behavior of CVD Diamond
Published online by Cambridge University Press: 22 February 2011
Abstract
The fracture behavior of CVD diamond is examined by indentation experiments in which slow crack growth has been observed. Diamond films of 400μm thickness were prepared by plasma-enhanced CVD on a silicon substrate, subsequently removed from the substrate, and polished for indentation testing. A microhardness tester was used to produce Vickers indentations under low load. Crack length measurements over time revealed susceptibility to slow crack growth in ambient testing conditions. The stress-corrosion susceptibility coefficient, N, was measured as 9.3.
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- Copyright © Materials Research Society 1992
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