Hostname: page-component-8448b6f56d-tj2md Total loading time: 0 Render date: 2024-04-19T00:30:18.758Z Has data issue: false hasContentIssue false
  • English
  • Français

Grain Boundary Characteristics and Stress-induced Damage Morphologies in Sputtered and Electroplated Copper Films

Published online by Cambridge University Press:  01 February 2011

Hyun Park ,
Soo-Jung Hwang ,
Kyu Hwan Oh  and
Young-Chang Joo
Hyun Park
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151-742, Korea
Soo-Jung Hwang
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151-742, Korea
Kyu Hwan Oh
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151-742, Korea
Young-Chang Joo
Affiliation:
School of Materials Science and Engineering, Seoul National University, Seoul 151-742, Korea
Get access

Abstract

Various Cu films were fabricated using sputtering and electroplating with and without additive, and their surface damages after annealing were investigated. After annealing at 435°C, the difference between damage morphologies of the films was observed. In some films stressinduced grooves along the grain boundaries were observed, while in the others voids at the grain boundary triple junctions were observed. It was also observed that the stress-induced groove was formed along the high energy grain boundaries. To explain the morphological difference of surface damages, a simple parameter considering the contributions of grain structures and grain boundary characteristics to surface and grain boundary diffusions is suggested. The effective grain boundary area, which is a function of grain size, film thickness and the fraction of high energy grain boundaries, played a key role in the morphological difference.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 766: Symposium E – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics - 2003 , 2003 , E2.3
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Yost, F. G., Scripta Metall. 23, 1323, (1989).Google Scholar
2. Korhonen, M. A., Paszkiet, C. A. and Li, C.Y., J. Appl. Phys. 69, 8083, (1991).Google Scholar
3. Kordic, S., Augur, R. A., Dirks, A. G., and Wolters, R. A. M., Appl. Surf. Sci. 91, 197, (1995).Google Scholar
4. Borgesen, P., Lee, J. K., Gleixner, R., and Li, C.Y., Appl. Phys. Lett. 60, 1706, (1992).Google Scholar
5. Keller, R. R., Kalnas, C. E., and Phelps, J. M., J.Appl. Phys. 86, 1167, (1999).Google Scholar
6. Kordic, S., R. Wolters, A.M. and Troost, K. Z., J. Appl. Phys. 74, 5391, (1993).Google Scholar
7. Nucci, J. A., Shacham-Diamand, Y., and Sanchez, J. E. Jr, Appl. Phys. Lett. 66, 3585, (1995).Google Scholar
8. Nucci, J. A., Keller, R. R., Sanchez, J. E. Jr, and Shacham-Diamand, Y., Appl. Phys. Lett. 69, 4017, (1996).Google Scholar
9. Nucci, J. A., Keller, R. R., Field, D. P. and Shacham-Diamand, Y., Appl. Phys. Lett. 70, 1242, (1997).Google Scholar
10. Smith, U., Kristensen, N., Ericson, F. and Schweitz, J.A., J.Vac. Sci. Technol. A9, 2527, (1991).Google Scholar
11. Kristensen, N., Ericson, F. and Schweitz, J.A., J. Appl. Phys. 69, 2097, (1991).Google Scholar
12. Kristensen, N., Ericson, F., Schweitz, J.A. and Smith, U., Thin Solid Films, 197, 67, (1991).Google Scholar
13. Koike, J., Wada, M., Sanda, M. and Maruyama, K., Appl. Phy. Lett. 6, 1017, (2002).Google Scholar
14. Sekiguchi, A., Koike, J., Kamiya, S., Saka, M. and Maruyama, K., Appl. Phys. Lett. 79, 1264, (2001).Google Scholar
15. Weiss, D., Ph. D. Dissertation, Max Plank Institute fur Metallforschung, Stuttgart, Germany (2000).Google Scholar
16. Weiss, D., Kraft, O. and Arzt, E., J. Mater. Res. 17, 1363, (2002).Google Scholar
17. Kang, S. H., Obeng, Y. S., Decker, M.A., Oh, M., Merchant, S.M., Karthikeyan, S.K., Seet, C. S. andOates, A. S., J. Electro. Mater. 30, 1506, (2001).Google Scholar
18. Thouless, M. D., Acta metal. Mater. 41, 1057, (1993).Google Scholar
19. Genin, F. Y., Mullins, W. W. and Wynblatt, P., Actametall.Mater. 41, 3541, (1993).Google Scholar
20. Genin, F. Y., Acta metall. Mater. 43, 4289, (1995).Google Scholar
21. Gao, H., Zhang, L., Nix, W. D., Thompson, C.V. and Arzt, E., Acta mater. 47, 2865, (1999).Google Scholar
22. Kobrinsky, M. J. and Thompson, C. V. and Gross, M. E., J. Appl. Phys. 89, 91–98, (2001).Google Scholar
23. Zhang, L. and Gao, H., Z. Metallkd. 93, 417, (2002).Google Scholar