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Grain Size Distribution and Degree of Texture in Films Used in Integrated Circuits

Published online by Cambridge University Press:  10 February 2011

R. Lindsay
Affiliation:
Department of Physics and Astronomy, University of Glasgow, Glasgow, UK
J. N. Chapman
Affiliation:
Department of Physics and Astronomy, University of Glasgow, Glasgow, UK
A. J. Craven
Affiliation:
Department of Physics and Astronomy, University of Glasgow, Glasgow, UK
D. Mcbain
Affiliation:
Motorola Ltd, East Kilbride, UK
I. Molchanov
Affiliation:
Department of Statistics, University of Glasgow, Glasgow, UK
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Abstract

As miniaturisation proceeds, the electrical properties of conductive films used in modem IC's are increasingly influenced by the grain sizes and the texture of the films. There is a need therefore to devise techniques which can examine these properties. Described in this work are two new cross-sectional TEM techniques for use on fully-processed IC's to determine quantitatively grain size distributions and the degree of texture in a film. The technique which investigates texture is used to determine how quickly the texture develops through a polysilicon film.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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