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A Grinding/Polishing Tool for TEM Sample Preparation

Published online by Cambridge University Press:  21 February 2011

S. J. Klepeis ,
J. P. Benedict  and
R. M. Anderson
S. J. Klepeis
Affiliation:
IBM Corporation, Route 52, Bldg. 630, Zip E70, Hopewell Junction, NY 12533-0999
J. P. Benedict
Affiliation:
IBM Corporation, Route 52, Bldg. 630, Zip E70, Hopewell Junction, NY 12533-0999
R. M. Anderson
Affiliation:
IBM Corporation, Route 52, Bldg. 630, Zip E70, Hopewell Junction, NY 12533-0999
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Abstract

A grinding/polishing tool has been developed for preparing TEM samples. The hand-held tool is 2.50″ in diameter and 3.0″ high. Rough-cut samples, 300 to 600 microns thick, are routinely polished to 5 microns thick in four to six hours using this tool. As these 5 micron samples are so thin and uniform, a separate dimpling operation can be eliminated. Likewise, the time required to ion-mill the sample can be reduced to 0.5 to 2.0 hours – greatly reducing ion-milling artifacts and significantly increasing the area viewable by TEM. The process is equally effective for all classes of samples: Silicon devices, ceramics or metals – in either cross-section or planar views.

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References

REFERENCES

[1] M-Bond 610 is a product of Measurement Group, Inc., P.O. Box 27777, Raleigh, NC 27611.Google Scholar
[2] The Wax is a product of Gatan, 780 Commonwealth Dr., Warrendale, PA 15086Google Scholar
[3] The Metal Bonded Diamond Wheel and the Lecloth (Flocked-Twill) are made by Leco Corp., 3000 Lakeview Avenue, St. Joseph, MI 49085-2396Google Scholar
[4] The Lapping film is a product of Microfinishing Systems Project Industrial Abrasives Division/3M 251-2A-08 3M Center, St. Paul, MN 55144Google Scholar
[5] The Glass Plate is a product of Grayco Co., Lindenhurst, NJ 11757Google Scholar
[6] Syton is available from Remet Chemical Co., Chadwicks, NY 13319Google Scholar