Skip to main content
×
Home

High Performance Metallization Issues for Ulsi

  • Robert Rosenberg (a1)
Abstract
ABSTRACT

The microelectronics industry is accelerating towards increasingly sophisticated circuit technology to interface with and drive a wide spectrum of products from low power to supercomputation systems. The base Si CMOS technology will span the applications such that optimization must be achieved by personalized wiring for each industry sector. As the feature size decreases to 0.25/µm or less, the interconnect metallization becomes a dominant technological challenge as circuit speeds, reliability and manufacturing costs are directly affected. The label "high performance" must now be defined in the context of the application. For example, as scaling proceeds for increased density and circuit speed, current density increase will impact lifetime by electromigration. Methods of simulation of fundamental degradation modes and design software tools must be developed and used in concert with performance simulation to optimize interconnect metallization ground rules early in the development cycle. Availability of such tools for interconnects is practically nonexistent, spurring significant focus on this direction by the materials community.

Copyright
References
Hide All
1Thompson C. V. and Kahn H., J. Electronic. Materials, 22, 581 (1993).
2Attardo M. J. and Rosenberg R., J. Appl. Phys., 41, 2381 (1970).
3Kraft O., Bader S., Sanchez J. E. Jr. and Arzt E., in Materials Reliability in Microelectronics III, ed. by Rodbell K. P., Filter W. F., Frost H. J. and Ho P. S. (Mater. Res. Soc. Proc. 309, Pittsburgh, PA, 1993) pp. 199210.
4Paraszczak J., Edelstein D.. Cohen S., Babich E. and Hummel J., IEDM, Wash. D.C., pp 261-264 (1993).
5Luther B., et al. ., Proc. 10th VLSI Multilevel Interconnection Conf., Santa Clara, CA, pp 1521 (1993).
6Harper J. M. E., et al. ., to be published in Copper Metallization II, MRS Bulletin, Vol. XIX (1994).
7Sai-Halasz G. A., Proc. IEEE. Int. Conf. Comp. Design. 230 (1992).
Recommend this journal

Email your librarian or administrator to recommend adding this journal to your organisation's collection.

MRS Online Proceedings Library (OPL)
  • ISSN: -
  • EISSN: 1946-4274
  • URL: /core/journals/mrs-online-proceedings-library-archive
Please enter your name
Please enter a valid email address
Who would you like to send this to? *
×

Metrics

Full text views

Total number of HTML views: 0
Total number of PDF views: 1 *
Loading metrics...

Abstract views

Total abstract views: 23 *
Loading metrics...

* Views captured on Cambridge Core between September 2016 - 24th November 2017. This data will be updated every 24 hours.