Hostname: page-component-cb9f654ff-mwwwr Total loading time: 0 Render date: 2025-08-30T07:10:54.653Z Has data issue: false hasContentIssue false
  • English
  • Français

High Tc Superconductors using Solution Techniques

Published online by Cambridge University Press:  21 February 2011

P. Barboux ,
I. Valente ,
J.M. Tarascon ,
S. Khan ,
F. Shokoohi ,
M. Henry ,
R. Morineau  and
B.G. Bagley
P. Barboux
Affiliation:
Chimie de la Matière Condensée, Université P. et M. Curie, 4 Place Jussieu, 75005 Paris, France Bellcore, 331 Newman Springs Rd, Red Bank, NJ07701, USA
I. Valente
Affiliation:
Chimie de la Matière Condensée, Université P. et M. Curie, 4 Place Jussieu, 75005 Paris, France
J.M. Tarascon
Affiliation:
Bellcore, 331 Newman Springs Rd, Red Bank, NJ07701, USA
S. Khan
Affiliation:
Bellcore, 331 Newman Springs Rd, Red Bank, NJ07701, USA
F. Shokoohi
Affiliation:
Bellcore, 331 Newman Springs Rd, Red Bank, NJ07701, USA
M. Henry
Affiliation:
Chimie de la Matière Condensée, Université P. et M. Curie, 4 Place Jussieu, 75005 Paris, France
R. Morineau
Affiliation:
Chimie de la Matière Condensée, Université P. et M. Curie, 4 Place Jussieu, 75005 Paris, France
B.G. Bagley
Affiliation:
Bellcore, 331 Newman Springs Rd, Red Bank, NJ07701, USA
Get access

Abstract

We have investigated different solution techniques to synthesize the Cu-based superconductors in the thick film form. Thick films of YBa2Cu3O7 have been produced using controlled precipitation techniques. Bi-based and Tl-based materials have been deposited by spraying of ionic solutions. The numerous difficulties encountered during each process are analyzed in order to propose new synthesis procedures such as a new method, based on the precipitation of hydroxides only, which is described as a prospective for lowering the synthesis temperature and shortening the reaction time.

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

(1) Murphy, D.W., Johnson, D.W. Jr., Jin, S. and Howard, R.E., Science, 241 (1988) 922.Google Scholar
(2) Cava, R.J., Batlogg, B., VanDover, R.B., Murphy, D.W., Sunshine, S., Siegriest, T., Remeika, J.P., Rietman, E.A., Zahurak, S. and Espinosa, G., Phys. Rev. Let. 58 (1987) 1676.Google Scholar
(3) LePage, Y., McKinnon, W.R.,Tarascon, J.M., Greene, L.H., Hull, G.W. and Hwang, D.W., Phys. Rev. B35 (1987) 7245.Google Scholar
(4) Tarascon, J.M., LePage, Y., Barboux, P., Bagley, B.G., Greene, L.H., McKinnon, W.R., Hull, G.W., Giroud, M., and Hwang, D., Phys. Rev. B38 (1988) 2504.Google Scholar
(6) Sheng, Z.Z. and Hermann, A., Nature 332 (1988) 138.Google Scholar
(7) Parkin, S.S., Lee, V.Y., Engler, E.M., Nazzal, A.I., Huang, T.C., Gorman, G., Savoy, R., and Beyers, R., Phys. Rev. Lett. 60 (1988) 2539.Google Scholar
(8) Subramanian, M.A., Calabrese, J.C., Torardi, C.C., Gopalakrishnan, J., Askew, T.R., Flippen, R.B., Morissey, K.J., Chowdry, U., and Sleigth, A. W., Nature 332 (1988) 420.Google Scholar
(9) Johnson, D.W. and Grader, G.S., J. Am. Ceram. Soc. 71 (1988) C–291.Google Scholar
(10) Jin, S., Tiefel, T.H., Sherwood, R.C., Davis, M.E., Van Dover, R.B., Kammlot, G.W., Fastnacht, R.A., and Keith, H.D., Appl. Phys. Let. 52 (1988) 2074.Google Scholar
(11) Laibowitz, R.B., Koch, R.H., Chaudari, P. and Gambino, R.J., Phys. Rev. B 35 (1987) 8821.Google Scholar
(12) Dijjkamp, D., Venkatesan, T., Wu, X.D., Shaheen, S.A., Jisrawi, N., Min-Lee, Y.H., McLean, W.L., and Croft, M., Appl. Phys. Lett. 51 (1987) 619.Google Scholar
(13) Tanaka, S. and Itozaki, H., Japn. J. of Applied Phys. 27 (1988) L622.Google Scholar
(14) Barboux, P., Tarascon, J.M., Bagley, B.G., Greene, L.H., Hull, G.W., Meagher, B.W. and Eom, C.B., Mat. Res. Soc. Symp. Proc. 99 (1988) 49.Google Scholar
(15) Nakahara, S., Fisanick, G.J., Dover, M.F. Van, Boone, T., and Moore, R., J. Cryst. Growth 85 (1987) 639.Google Scholar
(16) Horowitz, McLain, S.J., Sleight, A.W., Druliner, J.D., Gai, P.L. and Vankavelaar, M.J., Science 243 (1989) 66.Google Scholar
(17) Sol-Gel Technology for thin films, fibers, preforms, Electronics and Specialty shapes, Klein, L.C. Ed., Noyes Publications, Park Ridge, New Jersey (1988).Google Scholar
(18) Livage, J., J. of Solid State Chemistry 64 (1986) 322.Google Scholar
(19) Flaschen, S.S., J. Am. Chem. Soc. 77 (1955) 6194.Google Scholar
(20) Chaput, F. and Boilot, J.P., J. Mat. Sci. Let. 6 (1987) 1110.Google Scholar
(21) Livage, J. and Henry, M., in Ultrastructure Processing and Advanced Ceramics, McKenzie, J.D. and Ulrich, D.R. Eds., Wiley Interscience Publications, New York, (1988) 183.Google Scholar
(22) Shibata, S., Kitagawa, T., Okazaki, H., Kimura, T. and Murakami, T., Jap. J. of Appl. Phys. 27 (1988) L53.Google Scholar
(23) Wang, X.Z., Henry, M., Livage, J. and Rosenman, I., Solid State Com. 64 (1987) 881 Google Scholar
(24) Dunn, B., Chu, C.T., Zhou, L.W., Cooper, J.R., Gruner, G., Adv. Ceram. Mat. 2 (1987)Google Scholar
(25) Barboux, P., Tarascon, J.M.,Greene, L.H., Hull, G.W. and Bagley, B.G., J. Appl. Phys. 63 (1988) 2725.Google Scholar
(26) Kozuka, H., Umeda, T., Jin, J., Miyaji, F. and Sakka, S., J. Ceram. Soc. Japan, 96 (1988) 355.Google Scholar
(27) Tarascon, J.M., Barboux, P., Bagley, B.G., Greene, L.H. and Hull, G.W., Mat. Sci. and Eng. B1 (1988) 29.Google Scholar
(28) Manthiram, A. and Goodenough, J.B., Nature, 379, (1987) 701.Google Scholar
(29) Kawai, M., Kawai, T., Masuhira, H. and Takahasi, M., Jap. J. of Appl. Phys. 26 (1987) L1740.Google Scholar
(30) Gupta, A., Koren, G., Giess, E.A., Moore, N.R., Sullivan, E.J.M. and Cooper, E.I.. Appl. Phys. Lett. 52 (1988) 163.Google Scholar
(31) Khan, S. A., Barboux, P., Bagley, B.G. and Torres, F.E., J. Non Crystalline Solids (in press).Google Scholar
(32) Barboux, P., Tarascon, J.M., Shokoohi, F., Wilkens, B. J. and Schwartz, C.L., J. Appl. Phys. 64 (1988) 6382.Google Scholar
(33) Cooper, E. I., Giess, E.A., and Gupta, A., Mater. Lett. 7 (1988) 5.Google Scholar
(34) Valente, I. et al. (to be published).Google Scholar
(35) Khurana, B.S.,Tripathi, R.B., Khullar, S.M., Kotnala, R.K., Singh, S.,Jain, K., Reddi, B.V., Goel, R.C. and Das, B.K., J. Mat. Sci. Let. 8 (1989) 234.Google Scholar