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High-Aspect-Ratio Micromachining of Fluoropolymers Using Focused Ion Beam

Published online by Cambridge University Press:  01 February 2011

Yoshinori Matsui ,
Nozomi Miyoshi ,
Akihiro Oshima ,
Shu Seki ,
Masakazu Washio  and
Seiichi Tagawa
Yoshinori Matsui
Affiliation:
matsui62@sanken.osaka-u.ac.jp, Osaka University, The Institute of Scientific and Industrial Research, 8-1 Mihogaoka, Ibaraki, Osaka, 567-0047, Japan
Nozomi Miyoshi
Affiliation:
nozomingo@moegi.waseda.jp, Waseda University, Research Institute for Science and Engineering, 3-4-1 Okubo Shinjuku-ku, Tokyo, 169-8555, Japan
Akihiro Oshima
Affiliation:
akoshima@aoni.waseda.jp, Waseda University, Research Institute for Science and Engineering, 3-4-1 Okubo Shinjuku-ku, Tokyo, 169-8555, Japan
Shu Seki
Affiliation:
seki@sanken.osaka-u.ac.jp, Osaka Univ., The Institute of Scientific and Industrial Research, 8-1Mihogaoka, Ibaraki, Osaka, 567-0047, Japan, +81-6-6879-4309, +81-6-6879-4309
Masakazu Washio
Affiliation:
washiom@waseda.jp, Waseda University, Research Institute for Science and Engineering, 3-4-1 Okubo Shinjuku-ku, Tokyo, 169-8555, Japan
Seiichi Tagawa
Affiliation:
tagawa@sanken.osaka-u.ac.jp, Osaka University, The Institute of Scientific and Industrial Research, 8-1 Mihogaoka, Ibaraki, Osaka, 567-0047, Japan
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Abstract

Poly(tetrafluoroethylene) (PTFE) microstructure with high aspect ratio (> 200) and without solid debris along the edge was fabricated with high etch rate by using FIB. Gasification of PTFE by FIB is responsible for the high aspect ratio, the high etch rate, and the no solid debris. Roughness of etched surface of the PTFE increases with fluence, although edge of the etched area has good profiles. The etch mechanism seems to be complicated.

Keywords

ion-beam processinglithography (removal)polymer
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1020: Symposium GG – Ion-Beam-Based Nanofabrication , 2007 , 1020-GG02-09
Copyright
Copyright © Materials Research Society 2007

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