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High-Density, High-Speed Connectors Based on Flexible Etched Circuits

  • David B. Wrisley (a1)
Abstract
Abstract

With advances in semiconductor technology straining the ability of packaging to keep pace, conventional electrical connectors cannot always meet emerging requirements in interconnection density and signal transmission speeds.

Connectors using flexible etched circuits (FEC) can provide interconnection densities of up to 200 lines per inch and high transmission quality for signals with 250-picosecond risetimes. A practical connector design meeting these density and speed goals depends on careful consideration of connector and system tolerances, ease of application, manufacturability, and material properties.

This paper discusses a practical approach to an FEC-based connector and the influence of material properties on connector performance.

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References
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[1]High Density Connectors, Technologies and Markets, BPA (Technology & Management) Ltd, Report No. 431, November, 1991.
[2]Hill Jane M., Isolated Contact Physics on an Area-Array Flex Circuit Connector, Masters Thesis, Cornell University, August, 1993.
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MRS Online Proceedings Library (OPL)
  • ISSN: -
  • EISSN: 1946-4274
  • URL: /core/journals/mrs-online-proceedings-library-archive
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