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Improving Photoresist Spray Coating on 3D Structures for Microfluidic Devices

Published online by Cambridge University Press:  09 August 2012

Shinya Kumagai
Affiliation:
Toyota Technological Institute, 2-12-1 Hisakata, Tenpaku, Nagoya, 468-8511, Japan
Naoya Fukuda
Affiliation:
Toyota Technological Institute, 2-12-1 Hisakata, Tenpaku, Nagoya, 468-8511, Japan
Hisayoshi Tajima
Affiliation:
Toyota Technological Institute, 2-12-1 Hisakata, Tenpaku, Nagoya, 468-8511, Japan
Minoru Sasaki
Affiliation:
Toyota Technological Institute, 2-12-1 Hisakata, Tenpaku, Nagoya, 468-8511, Japan
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Abstract

Spray coating of a photoresist onto three-dimensional (3D) structure was investigated. To improve the uniformity of photoresist deposition onto the 3D structure, a shield plate with an aperture was used. The shield plate set over a sample permitted the resist deposition on the sample surface located in the aperture area while the plate blocked the deposition for the other area. The spray flow which is suitable for the resist deposition can be used effectively. Numerical analysis revealed that the vertical velocity component of gas flow was enhanced in the aperture area. In the experiments of the spray coating, the difference between the resist film thicknesses deposited on top and bottom trench surfaces was decreased. On the trench sidewall, resist bump formation, which was frequently observed in spray coating, was suppressed. The uniform resist deposition is necessary to realize 3D microdevices by lithography. In the microfluidic devices of dielectrophoresis, aside from the top and botttom trench surfaces, the trench sidewall can be used to fabricate device structures such as electrode for dielectrophoresis.

Type
Articles
Copyright
Copyright © Materials Research Society 2012

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References

REFERENCES

1. Padmaraj, D., Zagozdzon-Wosik, W., Xie, L.-M., Hadjiev, V. G., Cherukuri, P. and Wosik, J., Nanotechnology 20, 035201 (2009).Google Scholar
2. Chen, Z., Hu, W. and Guo, J.: J. Vac. Sci. Technol. B 22, 776 (2004).Google Scholar
3. Vijayaraghavan, A., Blatt, S., Weissenberger, D., Oron-Carl, M., Hennrich, F., Gerthsen, D., Hahn, H. and Krupke, R., Nano Lett. 7, 1556 (2007).Google Scholar
4. Doh, I. and Cho, Y.-H., 121, 59 (2005).Google Scholar
5. Chen, D.F., Du, H. and Li, W.H., Sens. Actuatos. A 133, 329 (2007).Google Scholar
6. Yang, M. and Zhang, X., Sens. Actuators. A 135, 73 (2007).Google Scholar
7. Ino, K., Ishida, A., Inoue, K. Y., Suzuki, M., Koide, M., Yasukawa, T., Shiku, H. and Matsue, T., Sens. Actuators. B 153, 468 (2011).Google Scholar
8. Houjou, H., Motokawa, S., Ishizuka, M., Mizuno, J., Momma, T., Osaka, T. and Shoji, S., Proceeding of Transducers ’05, 2005, p.1437.Google Scholar
9. Pham, P., Texier, I., Larrea, A.-S., Blanc, R., Revol-Cavalier, F., Grateau, H. and Perraut, F., J. Electrostat. 65, 511 (2007).Google Scholar
10. Singh, V. K., Sasaki, M., Hane, K., Watanabe, Y., Takamatsu, H., Kawakita, M. and Hayashi, H., J. Micromech. Microeng. 15, 2339 (2005).Google Scholar
11. Pham, N. P., Tezcan, D. S., Ruythooren, W., Moor, P. D., Majeed, B, Baert, K. and Swinnen, B, J. Micromech. Microeng. 18, 125008 (2008).Google Scholar
12. Maury, P., Quemper, J.-M., Pocas, S., Vliet, D. V., Noordam, N., Berge, P. T. and Best, K., Microelectron. Eng. 87, 904 (2010).Google Scholar
13. Lu, Y., Zhang, Y., Lu, J., Mimura, A., Matsumoto, S. and Itoh, T., J. Micromech. Microeng. 20, 125013 (2010).Google Scholar
14. Kumagai, S., Tajima, H. and Sasaki, M., Jpn. J. Appl. Phys. 50, 106501 (2011).Google Scholar
15. Kumagai, S., Fukuda, N., Tajima, H. and Sasaki, M., Jpn. J. Appl. Phys. 51, 02BL04 (2012).Google Scholar
16. Sasaki, M., Hosono, T. and Kumagai, S., Proceeding of IEEE Optical MEMS Nanophotonics, 2009, p. 75.Google Scholar