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Influence of Substrate Temperature on the Structure of Tin-Films

Published online by Cambridge University Press:  28 February 2011

J. M. Molarius ,
A. S. Korhonen ,
E. Erola  and
E. Nykanen
J. M. Molarius
Affiliation:
Helsinki University of Technology, Dept.of Mining and Metallurgy, Lab.of Metal Working and Heat Treatment, Vuorimiehentie 2 A, 02150 Espoo, Finland.
A. S. Korhonen
Affiliation:
Helsinki University of Technology, Dept.of Mining and Metallurgy, Lab.of Metal Working and Heat Treatment, Vuorimiehentie 2 A, 02150 Espoo, Finland.
E. Erola
Affiliation:
Helsinki University of Technology, Dept.of Mining and Metallurgy, Lab.of Metal Working and Heat Treatment, Vuorimiehentie 2 A, 02150 Espoo, Finland.
E. Nykanen
Affiliation:
Helsinki University of Technology, Dept.of Mining and Metallurgy, Lab.of Metal Working and Heat Treatment, Vuorimiehentie 2 A, 02150 Espoo, Finland.
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Abstract

Three series of Ti-N films with varying nitrogen contents from about 8 to 52 at.% N were deposited by triode ion plating at temperatures of 773, 623 and 373 K, respectively.Marked changes in the structures of the films with decreasing temperature were observed by x-ray diffraction.Stoichiometric δ-TiN which showed (220) preferred orientation at 773 K changed to (111) at lower temperatures.At intermediate nitrogen concentrations α-Ti (002) decreased and a new ε-Ti2N (002) developed with decreasing temperature.Very smooth and dense films could be produced at the lower temperatures.

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Type
Articles
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MRS Online Proceedings Library (OPL) , Volume 68: Symposium C – Plasma Processing , 1986 , 351
Copyright
Copyright © Materials Research Society 1986

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