Hostname: page-component-76fb5796d-vfjqv Total loading time: 0 Render date: 2024-04-25T12:39:25.448Z Has data issue: false hasContentIssue false
  • English
  • Français

The In-Situ Measurement of Biaxial Modulus and Residual Stress of Multi-Layer Polymeric Thin Films

Published online by Cambridge University Press:  16 February 2011

Pinyen Lin  and
Stephen D. Senturia
Pinyen Lin
Affiliation:
Massachusetts Institute of Technology, Microsystems Technology Laboratory, Cambridge, MA 02139
Stephen D. Senturia
Affiliation:
Massachusetts Institute of Technology, Microsystems Technology Laboratory, Cambridge, MA 02139
Get access

Extract

Polymeric coatings have been used in many ways from automobile paints to package coatings for integrated circuits. It is important to understand the mechanical properties of coatings in order to ensure fulfilling their designed functions. To measure these properties, in situ measurement techniques are desirable since these techniques measure the mechanical properties of coatings in the presence of the correct residual stress. In addition, the coatings most commonly used are multi-layer structures, a fact which increases the difficulty of the mechanical analysis. At present, the in situ mechanical behavior of multi-layer coatings has not been well characterized, and very few researchers have reported a satisfactory way to analyze multi-layer problems.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 188: Symposium K – Thin Films: Stresses and Mechanical Properties II , 1990 , 41
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCE

1. Beams, J. W., in Structure and Properties of Thin Films, ed. Neugebauer, C. A., Newkirk, J. B., and Vermilyea, D. A., John Wiley & Sons, New York, p. 183–192, 1959.Google Scholar
2. Allen, M. G., Mehregany, M., Howe, R. T., and Senturia, S. D., Appl. Phys. Lett., 51 (4), 241, 1987.Google Scholar
3. Hinkley, J. A., J. Adhesion, 16, 115, 1983.Google Scholar
4. Pan, J. Y., Lin, P., Maseeh, F., and Senturia, S. D., IEEE Solid-State Sensors Workshop, Hilton Head Island, South Carolina, June 1990.Google Scholar
5. Lin, Pinyen, Ph. D. Thesis, Department of Materials Science and Engineering, Massachusetts Institute of Technology, 1990.Google Scholar
6. Altschuler, L. W., and Simms, J. A., U. S. Patent No. 4,632,964 (30 December 1986).Google Scholar
7. Antonelli, J. A., and Clementon, H., U. S. Patent No. 4,591,533 (27 May 1986).Google Scholar
8. Mehregany, M., Allen, M., and Senturia, S. D., IEEE Solid-State Sensors Workshop, Hilton Head Island, South Carolina, June 1986.Google Scholar
9. Maseeh, F. and Senturia, S. D., in Polyimides: Materials. Chemistry. and Characterization, ed. by Feger, C., Khojasteh, M. M. and McGrath, J. E., Elsevier Science Publishers B. V., Amsterdam, p. 575, 1989.Google Scholar