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Integrated CVD-PVD Al Plug Process for Sub-Quarter Micron Devices: Effects of Underlayer on the Via Filling and the Microstructure of the Al Film

  • Won-Jun Lee (a1), Jung Joo Kim (a1), Jun Ki Kim (a1), Jin Won Park (a1), Hyug Jin Kwon (a1), Heung Lak Park (a1) and Sa-Kyun Rha (a2)...

Abstract

The integrated CVD-PVD Al plug process was successfully applied to a sub-quarter micron device for the simultaneous formation of plugs and wires. The effects of the underlayer on the via filling and the microstructure of the CVD-PVD Al films were investigated. Three types of underlayers were examined in this work: the Ti film deposited by the ionized PVD (I-PVD) method, the MOCVD TiN film stacked on the I-PVD Ti film, and the PVD Al film deposited on the I-PVD Ti film. Excellent via filling was achieved by employing the MOCVD TiN/I-PVD Ti or the PVD Al/I-PVD Ti as an underlayer. When only I-PVD Ti film was used as an underlayer, complete via filling was not obtained, because the CVD Al film sealed the top of vias. The CVD-PVD Al film deposited on the PVD Al/I-PVD Ti underlayer also showed excellent crystallographic texture of Al <111> and surface morphology, which is superior to those of the CVD-PVD Al film deposited on the MOCVD TiN/I-PVD Ti underlayer.

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References

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1. Kim, J. K., U. S. Pat., 5,804,501 (1998).
2. Beinglass, I. and Naik, M., Thin Solid Films, 320, 35 (1998).10.1016/S0040-6090(97)01063-8
3. Konecni, A., Dixit, G., Russell, N. M., Luttmer, J. D. and Havemann, R. H., Thin Solid Films, 320, 52 (1998).10.1016/S0040-6090(97)01064-X
4. Gignac, L. M., Rodbell, K. P., Clevenger, L. A., Iggulden, R. C., Schnabel, R. F., Weber, S. J., Lavoie, C., Cabral, C. Jr., DeHaven, P. W., Wang, Y.-Y. and Boettcher, S. H., Advanced Metallization Conference in 1997 (MRS, Warrendale, 1998) p. 79.
5. Lee, W.-J., Kim, B. Y., Han, S. Y., Lee, J. W., Kim, J. K. and Park, J. W., Jpn. J. Appl. Phys., 39, (2000) (in press).
6. Lee, W.-J. and Park, J. W., Thin Solid Films, submitted.
7. Vaidya, S. and Sinha, A. K., Thin Solid Films, 75, 253 (1981).10.1016/0040-6090(81)90404-1
8. Knorr, D. B., Merchant, S. M., Biberger, M. A., J. Vac. Sci. Technol. B, 16, 2734 (1998).10.1116/1.590265
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MRS Online Proceedings Library (OPL)
  • ISSN: -
  • EISSN: 1946-4274
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