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Interconnection Technology for Modern Logic Devices; an Exercise in System Engineering to Assure Manufacturability

  • William T. Siegle (a1)

The history of the semiconductor IC has often been dominated by the issues associated with transistor engineering. In recent years however, it has become clear that successful mastery of advanced logic devices depends not only on transistor engineering, but also on the ability to engineer and manufacture multiple level metallization systems to form the interconnect structure of modern and dense logic ICs.

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MRS Online Proceedings Library (OPL)
  • ISSN: -
  • EISSN: 1946-4274
  • URL: /core/journals/mrs-online-proceedings-library-archive
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