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Investigations of the Bonding Changes Associated with Grain Boundary Embrittlement

Published online by Cambridge University Press:  10 February 2011

V. J. Keast ,
J. Bruley  and
D. B. Williams
V. J. Keast
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Bethlehem PA, 18015
J. Bruley
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Bethlehem PA, 18015
D. B. Williams
Affiliation:
Department of Materials Science and Engineering, Lehigh University, Bethlehem PA, 18015
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Abstract

The embrittlement of materials through the segregation of impurities to the grain boundaries is a common and industrially important problem. Despite considerable investigation, the mechanism by which the impurity elements cause embrittlement is not well understood. A change in the electron energy loss near edge structure (ELNES) has been observed at Cu grain boundaries containing Bi. This result provides experimental evidence that a change in the electronic structure at the grain boundary is responsible for embritdement.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 458: Symposium W – Interfacial Engineering for Optimized Properties , 1996 , 93
Copyright
Copyright © Materials Research Society 1997

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