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Ion Beam Mixing of Alternate Layers Of Ni-Nb and Ni-Cr

Published online by Cambridge University Press:  26 February 2011

A. K. Rai
Affiliation:
Universal Energy Systems, Inc., 4401 Dayton-Xenia Road, Dayton, Ohio 45432
R. S. Bhattacharya
Affiliation:
Universal Energy Systems, Inc., 4401 Dayton-Xenia Road, Dayton, Ohio 45432
M. H. Rashid
Affiliation:
Universal Energy Systems, Inc., 4401 Dayton-Xenia Road, Dayton, Ohio 45432
A. W. McCormick
Affiliation:
Universal Energy Systems, Inc., 4401 Dayton-Xenia Road, Dayton, Ohio 45432
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Abstract

Alternating layers of Ni and Nb with a total thickness of 1060Å, and Ni and Cr with a total thickness of 840Å were deposited by electron beam evaporation on silicon. The individual layer thicknesses were adjusted in such a way as to obtain 50/50 at% compositions of Ni-Nb and Ni-Cr; the thicknesses were around 100Å for Ni and 170Å for Nb, and 100Å of Ni and 110Å of Cr. The films were bombarded with 350 keV Cr+ ions at a dose of 2 × 10 ions cm. RBS and TEM techniques were used to study the mixing and microstructure. Almost complete mixing and amorphization have been observed for the Ni-Nb system. Ni-Cr film has revealed very little mixing compared to Ni-Nb film and the microstructure remained polycrystalline. Sputter (rf) deposited Ni-Cr film also remained polycrystalline both before and after ion irradiation. The Ni-Cr System appears to be an exception to the structural difference rule for amorphous phase formation by ion irradiation.

Type
Research Article
Copyright
Copyright © Materials Research Society 1986

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References

REFERENCES

1. Rai, A.K., Bhattacharya, R. S., McCormick, A. W., Pronko, P. P. and Khobaib, M.. Appl. Surface Sci. 21, 95 (1985) and Nucl. Inst. Methods B718, 694 (1985).Google Scholar
2. Liu, B.X., Johnson, W. L., Nicolet, M. A. and Lau, S. S. Nucl. Instr. Methods. 209/210. 229 (1983) Appl. Phys. Lett. 42, 45 (1983).Google Scholar
3. Giessen, B. C., Proc. 4th Int. Conf. on Rapidly quenched Metals, Eds., Masumoto, T. and Suzuki, K. Jap. Inst. Metals, Sendai 1, 213 (1982).Google Scholar
Egami, T. and Waseda, Y. J. Non Cryst. Solids 64 113 (1984).Google Scholar
4. Bhattacharya, R. S. and Rai, A. K., J. Appl. Phys. 58, 248 (1985) and 58, 2798 (1985).Google Scholar
5. Rai, A. K., Bhattacharya, R. S. and Rashid, M. H., Proc. of 43rd EMSA Meet. 290 (1985) also Thin Solid Films (To be published).Google Scholar
6. Cheng, Y. T.. Van Rossum, M., Nicolet, M. A. and Johnson, W. L. Appl. Phys. Lett. 45, 185 (1984)Google Scholar
Johnson, et al. Nucl. Instr. Methods B7/8, 657 (1985).Google Scholar
7. Miedema, A. R., Philips Techn. Rev. 36, 217 (1976).Google Scholar