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Laser-Based Area-Selective Processing Techniques for High-Density Interconnects

Published online by Cambridge University Press:  21 February 2011

Y.S. Liu  and
H. S. Cole
Y.S. Liu
Affiliation:
GE Research and Development Center; P.O. Box 8, Schenectady, NY, 12345
H. S. Cole
Affiliation:
GE Research and Development Center; P.O. Box 8, Schenectady, NY, 12345
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Abstract

This paper reviews several laser-based area-selective processing techniques developed for high-density multichip interconnection applications. Key material and process requirements for the development of a viable laser-direct-write interconnect technique on polyimide are addressed.

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References

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