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Light-Emitting and Hole-Transporting Polymers for LEDs

Published online by Cambridge University Press:  10 February 2011

Toshihiro Ohnishi ,
Shuji Doi ,
Masato Ueda ,
Fumi Yamaguchi  and
Takanobu Noguchi
Toshihiro Ohnishi
Affiliation:
Tsukuba Research Laboratory, Sumitomo Chemical Co. Ltd., 6 Kitahara, Tsukuba, Ibaraki, 300-32Japan, ohnishi@tuc.sumitomo-chem.co.jp
Shuji Doi
Affiliation:
Tsukuba Research Laboratory, Sumitomo Chemical Co. Ltd., 6 Kitahara, Tsukuba, Ibaraki, 300-32Japan, ohnishi@tuc.sumitomo-chem.co.jp
Masato Ueda
Affiliation:
Tsukuba Research Laboratory, Sumitomo Chemical Co. Ltd., 6 Kitahara, Tsukuba, Ibaraki, 300-32Japan, ohnishi@tuc.sumitomo-chem.co.jp
Fumi Yamaguchi
Affiliation:
Tsukuba Research Laboratory, Sumitomo Chemical Co. Ltd., 6 Kitahara, Tsukuba, Ibaraki, 300-32Japan, ohnishi@tuc.sumitomo-chem.co.jp
Takanobu Noguchi
Affiliation:
Tsukuba Research Laboratory, Sumitomo Chemical Co. Ltd., 6 Kitahara, Tsukuba, Ibaraki, 300-32Japan, ohnishi@tuc.sumitomo-chem.co.jp
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Abstract

Various copolymers of arylene vinylenes, having strong fluorescence, showed predominantly the emission in the multi-layer device using an electron-transporting material(ETM) such as tris(8-quinolinolato)aluminum(Alq3). The emission from Alq3 was suppressed due to the high hole-injection barrier from the copolymers to ETM in spite of low or no barriers of electron injection from ETM to the copolymers. We have successfully prepared highly hole-transporting polysilane having a triphenylamine group as a side chain(TPA-PS). The hole mobility as high as 10 cm3cm2/Vs is attributable to the intermolecular hopping process facilitated by the interaction between the polysilane backbone and the triphenylamine group. The polysilane is effectively used as a hole transporting material. The bilayer LED device consisting of TPA-PS and Akb3 showed high luminance (2000cd/m2) and high efficiency (4cd/A).

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 488: Symposium J – Electrical, Optical & Magnetic Properties of Organic IV , 1997 , 21
Copyright
Copyright © Materials Research Society 1998

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