Hostname: page-component-848d4c4894-wzw2p Total loading time: 0 Render date: 2024-05-15T03:39:49.740Z Has data issue: false hasContentIssue false

Low Temperature Synthesis of Plasma Teos SiO2

Published online by Cambridge University Press:  10 February 2011

T. Itani
Affiliation:
Inorganic Materials & Polymers Laboratory, Fujitsu Laboratories LTD., 10-1, Morinosato-Wakamiya, Atsugi 243-01, JAPAN E-mail: titani@flab.fujitsu.co.jp
S. Fukuyama
Affiliation:
Inorganic Materials & Polymers Laboratory, Fujitsu Laboratories LTD., 10-1, Morinosato-Wakamiya, Atsugi 243-01, JAPAN E-mail: titani@flab.fujitsu.co.jp
Get access

Abstract

In this study, we investigated the deposition temperature's affect on TEOS based Si02 properties and reaction mechanisms while changing the excitation frequency. We used a parallel-plate plasma reactor, and either 100 kHz or 13.56 MHz radio frequency to generate plasma. We found that 100 kHz plasma promotes SiO formation and improves the film properties at low deposition temperatures. We assume this to be due to the supplement of higher energy ions to the substrate surface in 100 kHz plasma. This in turn promotes the elimination reaction (condensation reaction) of OH that links to Si atoms as a terminator of surface SiO networks or precursor molecules.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Chin, B. L. and van de Ven, E.P., Solid State Technol, April, 119, 1988.Google Scholar
2 Emesh, I. T., D'Asti, G., Mercier, J. S., and Leung, P., J. Electrochem. Soc, Vol. 136, No. 11, 3404 (1989).Google Scholar
3 Nguyen, S., Dobuzinsky, D., Itarmon, D., Gleason, R., and Fridmann, S., J. Electrochem. Soc, Vol. 137, No. 7, 2209 (1990).Google Scholar
4 Bruce, R. H., J. Appl. Phys. 52 (12), 7064 (1981).Google Scholar
5 Chang, C. -P., Pai, C. S., and Hsieh, J. J., J. Appl. Phys. 67(4), 2119 (1990).Google Scholar
6 Sato, J., Muroyama, M., Kito, E., Kawashima, J., Semiconductor World, February, 75, 1994 [in Japanese].Google Scholar