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Mcm Development Using Fine Pitch Ball Bump

  • Akihiro Dohya (a1), Ikushi Morisaki (a1), Manabu Bonkohara (a1) and Hirofumi Nakamura (a1)

A fine-pitch ( less than 100 micro-meter pads pitch ) aluminum pad flip chip assembly technology for use with the built-up Printed Wiring Boards (PWB) has been developed and named “Lead-Less-Chip Assembly (LLC Assembly)” technology. Our newly developed technology consists of three points: Forming gold-ball-bumps on the aluminum pads of the bare LSI chip by a wire ball bonding method. Solder-coating on the copper pads of the built-up PWB using Micro Punching technology or the Super-Juffit technology. Flux-less solder bonding the bare chip onto the PWB with a nitrogen atmosphere.

A reliability evaluation performed on a single chip and multi chip modules assembled using this LLC Assembly technology with test chips and real C-MOS devices showed a high level of endurance. We have applied this technology to Multichip modules (MCMs) for Note Personal Computers and portable terminals.

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1 Tsukada, S. et al. , “Surface Laminar Circuit and Flip Chip Attach Packaging”, Proceeding of the 7th International Micro-electronics conference, pp. 252258, 1992.
2 Nakamura, H., et al. , “An Approach to the Low Cost Flip-Chip Technology Development with Punched-out Solder Disk by Micro-press Punching Method”, Proceeding of the 1996 on Multichip Modules Conference, pp. 3438, 1996.
3 Tanaka, K., et al., “A Fine-Pitch Lead-Less-Chip Assembly Technology with the Built-up PCB”, Proceeding of the 1996 International Conference on Multichip Modules, pp. 369374, 1996.
4 Bessyo, Y., et al. , “A Stud-Bump-Bonding Technique for High Density Multi-Chip-Module”, Proceeding of the Japan IEMT Symposium, pp.362365, 1993.
5 Katoh, Y., et al. , “Solder Bump Forming Technology and It's Fixture”, Proceeding of IEIC fall meeting June 23 rd, 1994
6 Kuramoto, T., et al. , “Recent technical movements for pre-coat of solder” June 1995 JPCA seminar.
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MRS Online Proceedings Library (OPL)
  • ISSN: -
  • EISSN: 1946-4274
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