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Mechanical Behaviour of Two Sorts of MCM Structures

Published online by Cambridge University Press:  21 February 2011

G. Pozza ,
G. Parat ,
M. Ignat ,
M. Dupeux  and
J. M. Terriez
G. Pozza
Affiliation:
Institut National Polytechnique de Grenoble, ENSEEG BP.75, Dom. Univ., 38402 Saint-Martin d'Hères, France.
G. Parat
Affiliation:
LETI, CEA, 17 Av. des Martyrs, 38054 Grenoble, France.
M. Ignat
Affiliation:
Institut National Polytechnique de Grenoble, ENSEEG BP.75, Dom. Univ., 38402 Saint-Martin d'Hères, France.
M. Dupeux
Affiliation:
Institut National Polytechnique de Grenoble, ENSEEG BP.75, Dom. Univ., 38402 Saint-Martin d'Hères, France.
J. M. Terriez
Affiliation:
Institut National Polytechnique de Grenoble, ENSEEG BP.75, Dom. Univ., 38402 Saint-Martin d'Hères, France.
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Abstract

We analysed the mechanical response of samples, representing Flip-Chip bonded type structures. Two sort of distributions of the PbSn solder bumps, interconecting a chip to a substrate were investigated. The mechanical response was established from macroscopic shear and tensile tests. The microstructural evolution to complete mechanical failure, was observed during similar tests, but performed in a Scanning Electron Microscope. These in-situ tests revealed a preferential crack nucleation site in the samples, specific to one of the interfaces. A complementary numerical analysis was developed, for trying to explain the preferential crack opening site.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 153
Copyright
Copyright © Materials Research Society 1995

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References

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