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The Microstructure of Copper Films Deposited by E-Beam Evaporation onto Thin Polyimide Films

Published online by Cambridge University Press:  22 February 2011

J. T. Wetzel
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
D. A. Smith
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
G. Appleby-Mougham
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Heights, N.Y. 10598
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Abstract

Copper was deposited by electron beam evaporation onto both freshly cleaved bare and polyimide-coated (001) NaCl at substrate temperatures of 20°, 100°, 200° and 300°C at rates of 2 and 20,Åsec−1. For all substrate temperatures and deposition rates investigated, the Volmer-Weber mode of film growth was observed for copper both on polyimide and on NaCl. Comparisons of film growth on the two substrates for a constant substrate temperature revealed differences in film thickness at which copper became continuous or formed a completely coalesced film. It was found that copper grown on polyimide formed continuous and completely coalesced films at smaller film thicknesses than on NaCI. However once a completely coalesced film was obtained, grain growth in the copper films proceeded more rapidly on NaC1 substrates than on polyimide substrates.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

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References

1. Smith, D.A., Wetzel, J.T. and Taranko, A.R., Proceedings of the 1984 Fall MRS Meeting, Symposium D, Gibson, J.M. and Dawson, L.R., eds., to be publishedGoogle Scholar
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