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Modification of Copper Surfaces: Effect on Adhesion at the Copper Polyimide Interface

Published online by Cambridge University Press:  21 February 2011

P. P. Parekh ,
K. T. Kembaiyan ,
K. E. Gonsalves ,
A. Bocarsly  and
L. Amos
P. P. Parekh
Affiliation:
Stevens Institute of Technology, Department of Chemistry and Chemical Engineering, Hoboken, New Jersey 07030
K. T. Kembaiyan
Affiliation:
Stevens Institute of Technology, Department of Chemistry and Chemical Engineering, Hoboken, New Jersey 07030
K. E. Gonsalves
Affiliation:
Stevens Institute of Technology, Department of Chemistry and Chemical Engineering, Hoboken, New Jersey 07030
A. Bocarsly
Affiliation:
Princeton University, Department of Chemistry, Princeton, New Jersey 08544
L. Amos
Affiliation:
Princeton University, Department of Chemistry, Princeton, New Jersey 08544
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Abstract

Copper surfaces were derivatized resulting in the formation of Mx[Cu(II)(CN)Fe(II/III)(CN)5] at the interface. Polyimides were spin coated onto the modified metal surfaces and the degree of adhesion measured by the tape pull test. Effects of mechanical interlocking were evident in the case of modified copper samples, due to derivatization by ferricyanide. The chemical bonding and elemental analyses of the interfaces were studied by XPS and SEM.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 119: Symposium F – Adhesions in Solids , 1988 , 277
Copyright
Copyright © Materials Research Society 1988

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