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A New Method for Measuring Ion Implantation Amorphous Dose In Situ

Published online by Cambridge University Press:  28 February 2011

Jianzhong Yuan
Affiliation:
The Institute for the Study of Defects in Solids, Department of Physics, State University of New York at Albany, Albany, NY 12222, USA
Igor V. Verner
Affiliation:
The Institute for the Study of Defects in Solids, Department of Physics, State University of New York at Albany, Albany, NY 12222, USA
James W. Corbett
Affiliation:
The Institute for the Study of Defects in Solids, Department of Physics, State University of New York at Albany, Albany, NY 12222, USA
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Abstract

An in situ method for determining the ion implantation dose necessary to make Si amorphous is developed and utilized. This method is based on measuring ion-implantation-induced in-plane stress. Measurements are carried out for various low energy ions implanted into thin p-type (100) Si. The doses necessary to make Si amorphous obtained by this method are in good agreement with previous data. This technique is sensitive, informative, quick, visual and nondestructive.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

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References

REFERENCES

1. Corbett, J.W., Karins, J.P. and Tan, T.Y., Nucl. Inst. and Methods 182/183 (1981) 457. CrossRefGoogle Scholar
2. Brinkman, J.A., J. Appl. Phys. 25 (1974) 961.Google Scholar
3. Brinkman, J.A., Am. J. Phys. 24 (1956) 246.Google Scholar
4. Nelson, R.S., in Ion Implantation, eds., Dearnley, G., Freeman, J.H., Nelson, R.S. and Stephen, J. (North-Holland, Amsterdam, 1973) p. 144.Google Scholar
5. Yuan, J.Z. and Corbett, J.W., submitted to Rad. Eff.Google Scholar
6. Vook, F.L. Stein, H.J., Rad. Eff. 2 (1969) 23.Google Scholar
7. Chadderton, L.T., Rad. Eff. 8 (1971) 77.Google Scholar
8. Morhead, F.F. and Crowder, B.L., Rad. Eff. 6 (1970) 27.CrossRefGoogle Scholar
9. Gibbons, J.F., Proc. IEEE 60, (1972) 1062.CrossRefGoogle Scholar
10. Dennis, J.R. and Hale, E.B., Rod. Eff. 19 (1973) 67.Google Scholar
11. Vook, F.L., in Radiation damage in Semiconductors, ed. Whitehouse, J.E. (Institute of Physics, London, 1972) p. 60.Google Scholar
12. Muller, H., Schmid, K., Ryssel, H. and Ruge, I., in Ion Implantation in Semiconductors and Other Materials, ed. Crowder, B.L. (Plenum, New York, 1973) p. 203.CrossRefGoogle Scholar
13. Meek, R.L., Gibson, W.M., and Scellschop, J.P.F., Rod. Eff. 11 (1971) 139.CrossRefGoogle Scholar
14. Volkert, C.A., in Beam-Solid Interactions: Physical Phenomena, MRS Symposia Proceedings, ed. Knapp, J.A., Borgesen, P., and Zuhr, R.A. (MRS, Pittsburgh, PA, 1990), p. 635.Google Scholar
15. Yuan, J.Z. and Corbett, J.W., 22nd NATO Advanced Material Institute, Italy 1991.Google Scholar
16. Hoffman, R.W., in Physics of Thin Films, ed. Hass, G. and Thun, R.E. (Academic Press, New York, 1966) p. 211.Google Scholar
17. Yuan, J.Z., Corbett, J.W. and Yencha, A.J., 16th Int'l Conf. on Defects in Semiconductors, Bethleham, PA, 1991 Google Scholar
18. Dennis, J.R. and Hale, E.B., J. Appl. Phys., 49(3) (1978) 1119. CrossRefGoogle Scholar
19. Danilin, A.B. and Mordkovich, V.N., Rod. Eff. and Def in Solids, 113, (1990) 277.Google Scholar
20. Yuan, J.Z., Verner, I.V., Maksimov, S.K., and Corbett, J.W., in present volume of Mater. Res. Soc. Symp., 1991.Google Scholar
21. Liefting, J.R., Raineri, V., Schreutelkamp, R.J., Custer, J.S., and Saris, F.W., in present volume of Mater. Res. Soc. Symp., 1991.Google Scholar
22. Volkert, C.A., J. Appl. Phys. 70(7) (1991) 3521. Google Scholar