Hostname: page-component-54dcc4c588-r5qjk Total loading time: 0 Render date: 2025-10-05T09:54:59.345Z Has data issue: false hasContentIssue false
  • English
  • Français

A Novel Retaining Ring in Advanced Polishing Head Design for Significantly Improved CMP Performance

Published online by Cambridge University Press:  10 February 2011

Thomas H. Osterheld ,
Steve Zuniga ,
Sidney Huey ,
Peter McKeever ,
Chad Garretson ,
Ben Bonner ,
Doyle Bennett  and
Raymond R. Jin
Thomas H. Osterheld
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Steve Zuniga
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Sidney Huey
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Peter McKeever
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Chad Garretson
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Ben Bonner
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Doyle Bennett
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Raymond R. Jin
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Get access

Abstract

This paper reports a technological advancement in developing and implementing a novel retaining ring of advanced edge performance (AEPTM ring) for an advanced polishing head design. The AEP ring has been successfully used for significantly improved CMP performance in different CMP applications: oxide (PMD and ILD), shallow trench isolation (STI), polysilicon, metal (W and Cu), silicon-on-insulator (SOI), and silicon CMP. Robust processes have been developed using AEP ring along with many hardware upgrades for each application with extended runs to meet requirements of advanced IC device fabrication.

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

1. Jin, Raymond, Prabhu, Gopal, Mear, Steve, Huey, Sidney, Tolles, Robert, Redeker, Fritz, “Significant improvement of disk/pad life and polishing performance by using a new pad conditioning disk”, proceedings of 1998 VMIC conference, pp. 527–529.Google Scholar
2. Lum, Robert, Mishra, Sourabh, Redeker, Fritz, Brown, Brian, Wijekoon, Kapila, Lin, Ronald, Nanjangud, Savitha, “Defects characterization and productivity optimization of tungsten CMP process”, presented at 1999 SEMICON Korea, Seoul, Korea, February 22–24, 1999.Google Scholar
3. Jin, Raymond, Li, Shijian, Fang, Simon, Redeker, Fritz, “Proven practice and future application of polysilicon CMP in IC fabrication”, proceedings of 1998 SEMICON Taiwan, pp. 263–274.Google Scholar
4. Osterheld, Thomas H., Garretson, Chad, McKeever, Peter, Ben Bonner, to be published.Google Scholar
5. Jin, Raymond, David, Jeffrey, Abbassi, Bob, Osterheld, Thomas, Redeker, Fritz, “A proven shallow trench isolation (STI) solution using novel CMP concepts”, proceedings of 1999 CMP-MIC conference, pp. 314-321.Google Scholar
6. Jin, Raymond, “New generation CMP equipment and its impact on IC devices”, 1998. proceedings of 5th International Conference on Solid-State and Integrated-Circuit Technology, pp. 116-119.Google Scholar