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A Novel Retaining Ring in Advanced Polishing Head Design for Significantly Improved CMP Performance

Published online by Cambridge University Press:  10 February 2011

Thomas H. Osterheld ,
Steve Zuniga ,
Sidney Huey ,
Peter McKeever ,
Chad Garretson ,
Ben Bonner ,
Doyle Bennett  and
Raymond R. Jin
Thomas H. Osterheld
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Steve Zuniga
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Sidney Huey
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Peter McKeever
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Chad Garretson
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Ben Bonner
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Doyle Bennett
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
Raymond R. Jin
Affiliation:
Applied Materials, 3111 Coronado Drive, M/S 1510, Santa Clara, CA 95054
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Abstract

This paper reports a technological advancement in developing and implementing a novel retaining ring of advanced edge performance (AEPTM ring) for an advanced polishing head design. The AEP ring has been successfully used for significantly improved CMP performance in different CMP applications: oxide (PMD and ILD), shallow trench isolation (STI), polysilicon, metal (W and Cu), silicon-on-insulator (SOI), and silicon CMP. Robust processes have been developed using AEP ring along with many hardware upgrades for each application with extended runs to meet requirements of advanced IC device fabrication.

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References

REFERENCES

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