Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Yang, W.
Wang, W.
and
Suo, Z.
1994.
Cavity and dislocation instability due to electric current.
Journal of the Mechanics and Physics of Solids,
Vol. 42,
Issue. 6,
p.
897.
Wang, W.
Suo, Z.
and
Hao, T.-H.
1994.
Transgranular Slits in Aluminum Interconnects Caused by Thermal Stress and Electric Current.
MRS Proceedings,
Vol. 338,
Issue. ,
Arzt, E.
Kraft, O.
Nix, W. D.
and
Sanchez, J. E.
1994.
Electromigration failure by shape change of voids in bamboo lines.
Journal of Applied Physics,
Vol. 76,
Issue. 3,
p.
1563.
Suo, Z.
Wang, W.
and
Yang, M.
1994.
Electromigration instability: Transgranular slits in interconnects.
Applied Physics Letters,
Vol. 64,
Issue. 15,
p.
1944.
Arzt, E.
Kraft, O.
and
MÖckl, U.E.
1994.
Electromigration Damage in Conductor Lines: Recent Progress in Microscopic Observation and Mechanistic Modelling.
MRS Proceedings,
Vol. 338,
Issue. ,
Suo, Z.
and
Wang, W.
1994.
Diffusive void bifurcation in stressed solid.
Journal of Applied Physics,
Vol. 76,
Issue. 6,
p.
3410.
Kime, Yolanda J.
and
Grach, Peter
1994.
Geometric Characterization of Electromigration Voids.
MRS Proceedings,
Vol. 338,
Issue. ,
Maroudas, Dimitrios
and
Pantelides, Sokrates T.
1995.
Theory and Computer Simulation of Grain-Boundary and Void Dynamics in Polycrystalline Conductors.
MRS Proceedings,
Vol. 391,
Issue. ,
Marieb, T.
Flinn, P.
Bravman, J. C.
Gardner, D.
and
Madden, M.
1995.
Observations of electromigration induced void nucleation and growth in polycrystalline and near-bamboo passivated Al lines.
Journal of Applied Physics,
Vol. 78,
Issue. 2,
p.
1026.
Thouless, M.D.
and
Liniger, W.
1995.
Effects of surface and boundary diffusion on void growth.
Acta Metallurgica et Materialia,
Vol. 43,
Issue. 6,
p.
2493.
Kraft, O.
Möckl, U. E.
and
Arzt, E.
1995.
Shape changes of voids in bamboo lines: A new electromigration failure mechanism.
Quality and Reliability Engineering International,
Vol. 11,
Issue. 4,
p.
279.
Maroudas, Dimitrios
Enmark, Matthew N.
Leibig, Cora M.
and
Pantelides, Sokrates T.
1996.
Analysis of damage formation and propagation in metallic thin films under the action of thermal stresses and electric fields.
Journal of Computer-Aided Materials Design,
Vol. 2,
Issue. 3,
p.
231.
Knorr, D. B.
and
Rodbell, K. P.
1996.
The role of texture in the electromigration behavior of pure aluminum lines.
Journal of Applied Physics,
Vol. 79,
Issue. 5,
p.
2409.
Wang, Weiqing
Suo, Z.
and
Hao, T.-H.
1996.
A simulation of electromigration-induced transgranular slits.
Journal of Applied Physics,
Vol. 79,
Issue. 5,
p.
2394.
Suo, Z.
1997.
Vol. 33,
Issue. ,
p.
193.
Hao, T.-H.
and
Li, Q.-M.
1998.
Linear analysis of electromigration-induced void instability in Al-based interconnects.
Journal of Applied Physics,
Vol. 83,
Issue. 2,
p.
754.
Kraft, O.
and
Arzt, E.
1998.
Current density and line width effects in electromigration: a new damage-based lifetime model.
Acta Materialia,
Vol. 46,
Issue. 11,
p.
3733.
Gungor, M. Rauf
Maroudas, Dimitrios
and
Gray, Leonard J.
1998.
Effects of mechanical stress on electromigration-driven transgranular void dynamics in passivated metallic thin films.
Applied Physics Letters,
Vol. 73,
Issue. 26,
p.
3848.
Manca, J.V
Croes, K
De Ceuninck, W
D'Haeger, V
D'Haen, J
Depauw, P
Tielemans, L
and
De Schepper, L
1998.
Localized monitoring of electromigration with early resistance change measurements.
Microelectronics Reliability,
Vol. 38,
Issue. 4,
p.
641.
Lee, Samantha
Bravman, John C.
Flinn, Paul A.
and
Marieb, Tom N.
1998.
The Effects of Passivation Thickness and Initial Aluminum Line Stress on Electromigration Behavior.
MRS Proceedings,
Vol. 516,
Issue. ,