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Organic Memory Devices Using C60 and Insulating Polymer

Published online by Cambridge University Press:  01 February 2011

Alokik Kanwal ,
Shashi Paul  and
Manish Chhowalla
Alokik Kanwal
Affiliation:
Ceramic and Materials Engineering, Rutgers University Piscataway, NJ 08854
Shashi Paul
Affiliation:
Ceramic and Materials Engineering, Rutgers University Piscataway, NJ 08854
Manish Chhowalla
Affiliation:
Ceramic and Materials Engineering, Rutgers University Piscataway, NJ 08854
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Abstract

In this paper, we describe an all organic molecular memory device that combines the advantages of molecular and organic electronics. We accomplish this by combining C60 molecules with poly(4-vinylphenol) (PVP) and co-dissolving them in iso-propanol. The current-voltage measurements show a large hysteresis in the blend devices, in contrast to pure PVP devices. The thin blend films have been thoroughly characterized using Raman spectroscopy, atomic force microscopy and scanning electron microscopy.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 830: Symposium D – Materials and Processes for Nonvolatile Memories , 2004 , D7.2
Copyright
Copyright © Materials Research Society 2005

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References

REFERENCES

1. Forrest, S R Nature 428, 911 (2004).Google Scholar
2. Li, C, Fan, W D, Lei, B, Zhang, D H, Han, S, Tang, T, Liu, X L, Liu, Z Q, Asano, S, Meyyappan, M, Han, J and Zhou, C W Appl. Phys. Lett. 84, 1949 (2004).Google Scholar
3. Scott, J C, J C, , Science, 304, 62 (2004).Google Scholar
4. Ouyang, J., Chu, C., Szmanda, C. R., Ma, L., Yang, Y. Nature Materials 3, 918 (2004)Google Scholar
5. Guizzo, E IEEE Spectrum 41, 17 (2004).Google Scholar
6. Bozano, L D, Kean, B W, Deline, V R, Salem, J R and Scott, J C Appl. Phys. Lett. 84, 607 (2004).Google Scholar
7. Paul, S, Pearson, C, Molloy, A, Cousins, M A, Green, M, Kolliopoulou, S, Dimitrakis, P, Normad, P, Tsoukalas, D and Petty, M C Nano Lett. 3, 533 (2003).Google Scholar
8. Zerza, G, Brabec, J C, Cerullo, G, De Silvestri, S and Sariciftci, N S Synthetic Materials 119, 637 (2001).Google Scholar