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PECVD Silicon Carbide as a Thin Film Packaging Material for Microfabricated Neural Electrodes

Published online by Cambridge University Press:  15 March 2011

Allison Hess
Affiliation:
Electrical Engineering and Computer Science, Case Western Reserve University, Cleveland, OH, 44106
Rocco Parro
Affiliation:
Electrical Engineering and Computer Science, Case Western Reserve University, Cleveland, OH, 44106
Jiangang Du
Affiliation:
Electrical Engineering and Computer Science, Case Western Reserve University, Cleveland, OH, 44106
Jeremy Dunning
Affiliation:
Louis Stokes VA Medical Center, Cleveland, OH, 44016
Maximillian Scardelletti
Affiliation:
NASA Glenn Research Center, Cleveland, OH, 44135
Christian A. Zorman
Affiliation:
Electrical Engineering and Computer Science, Case Western Reserve University, Cleveland, OH, 44106
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Abstract

This paper reports our effort to develop amorphous silicon carbide (a-SiC) films for use as hermetic thin film coatings for mechanically-flexible neural electrodes. In our work, the a-SiC films were deposited by plasma enhanced chemical vapor deposition (PECVD) using two distinct methods, namely a single precursor approach using trimethylsilane, and a dual precursor approach using methane (CH4) and silane (SiH4). The mechanical properties of films deposited on Si substrates were characterized using the wafer curvature and load-deflection methods. The effectiveness of the films as moisture barriers for polyimide substrates was characterized by measuring the leakage currents of SiC-coated interdigitated electrode structures soaked in PBS. A microfabricated prototype of the flat interface nerve electrode (FINE) based on a flexible polyimide substrate and a PECVD SiC capping layer was fabricated using a monolithic process based on conventional micromachining techniques. To facilitate this approach, a reactive ion etching process was developed that exhibited high etch rates and high selectively to the SiC films.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

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References

1. Berthold, A., Laugere, F., Schellevis, H., Boer, C.R. de, Laros, M., Guijt, R.M., Sarro, P. M., and Vellekoop, M. J., Electrophoresis 23, 3511, (2002).Google Scholar
2. Bagolini, A., Pakula, L., Scholtes, T.L.M., Pham, H.T.M., French, P.J., and Sarro, P.M., J. Micromechanics and Microengineering 12, 385, (2002).Google Scholar
3. Flannery, A.F., Mourlas, N.J., Storment, C.W., Tsai, S., Tan, S.H., Heck, J., Monk, D., Kim, T., Gogoi, B., and Kovacs, G.T.A., Sens Actuators A, 70, 48, (1998).Google Scholar
4. Cogan, S.F., Edell, D.J., Guzelian, A. A., Liu, Y.P., and Edell, R., J. Biomed. Mat. Res. - Part A 67, 856, (2003).Google Scholar
5. Du, J., Singh, N., Summers, J., and Zorman, C., Mat. Res. Soc. Symp. Proc., 919, 283, (2006).Google Scholar
6. Summers, J., Scardelletti, M., Parro, R., and Zorman, C., Proc. SPIE, 6464, 64640H–1, (2007).Google Scholar
7.Dupont Website: www2.dupont.comGoogle Scholar