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Photo Etching of Polyimide Thin Film by TiO2 Micro Wire Prepared Using Phase Separation-Selective Leaching Method

Published online by Cambridge University Press:  01 February 2011

Y. Sone
Affiliation:
Department of Materials Science and Technology, Tokyo University of Science 2641 Yamazaki, Noda-shi, Chiba 278–8510 Japan
K. Nishio
Affiliation:
Department of Materials Science and Technology, Tokyo University of Science 2641 Yamazaki, Noda-shi, Chiba 278–8510 Japan
A. Yasumori
Affiliation:
Department of Materials Science and Technology, Tokyo University of Science 2641 Yamazaki, Noda-shi, Chiba 278–8510 Japan
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Abstract

TiO2 photocatalysts have a strong oxidation ability for organic compounds under UV irradiation. The surfaces of polyimide and polymethyl methacrylate (PMMA) were photocatalytically machined using a porous TiO2 wire prepared by phase separation and selective leaching with elongation. After UV irradiation, these surfaces were decomposed along the length of the TiO2 wire. Such surface decomposition depended on the irradiation angle of UV light and irradiation time. The machining rate of PMMA was higher than that of the polyimide.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

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