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Precision Ion Milling of Layered, Multi-Element TEM Specimens with High Specimen Preparation Spatial Resolution

Published online by Cambridge University Press:  21 February 2011

Ron Anderson  and
John Benedict
Ron Anderson
Affiliation:
IBM, Department 13W, Building 630-E40, East Fishkill Facility, Hopewell Junction, NY 12533 USA
John Benedict
Affiliation:
IBM, Department 13W, Building 630-E40, East Fishkill Facility, Hopewell Junction, NY 12533 USA
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Extract

It is now a requirement in the semiconductor industry to prepare TEM specimens of pre-specified regions with a specimen preparation resolution exceeding 100nm. In other words, given the coordinates x, y, z of the location desired for TEM analysis, the TEM specimen preparation procedure must yield a thin TEM specimen containing the point x, y, z plus or minus 100nm. Preparation of failure analysis specimens in other fields of endeavor, such as: metallurgical, ceramic, composite material laboratories etc., have specimen preparation spatial resolution requirements below one micron in some cases with the likelihood that greater precision will be required in the future.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 254: Symposium W – Specimen Preparation for Transmission Electron Microscopy of Materials III , 1991 , 141
Copyright
Copyright © Materials Research Society 1992

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References

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