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Recent Advances in 3D Integration at IMEC

Published online by Cambridge University Press:  26 February 2011

Piet De Moor ,
Wouter Ruythooren ,
Philippe Soussan ,
Bart Swinnen ,
Kris Baert ,
Chris Van Hoof  and
Eric Beyne
Piet De Moor
Affiliation:
demoor@imec.be, IMEC, MCP, Kapeldreef 75, Leuven, B-3001, Belgium
Wouter Ruythooren
Affiliation:
ruythooren@imec.be, IMEC, Kapeldreef 75, Leuven, B-3001, Belgium
Philippe Soussan
Affiliation:
soussan@imec.be, IMEC, Kapeldreef 75, Leuven, B-3001, Belgium
Bart Swinnen
Affiliation:
swinnen@imec.be, IMEC, Kapeldreef 75, Leuven, B-3001, Belgium
Kris Baert
Affiliation:
Kris.Baert@imec.be, IMEC, Kapeldreef 75, Leuven, B-3001, Belgium
Chris Van Hoof
Affiliation:
Chris.VanHoof@imec.be, IMEC, Kapeldreef 75, Leuven, B-3001, Belgium
Eric Beyne
Affiliation:
Eric.Beyne@imec.be, IMEC, Kapeldreef 75, Leuven, B-3001, Belgium
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Abstract

IMEC is focusing its 3D-integration technology developments in 3 distinct directions: 3D-System-in-a-Package (3D-SiP), 3D-Wafer-Level-Packaging (3D-WLP) and 3D-Stacked-IC (3D-SiC). First, the background of these separate approaches will be given. Next the materials and technologies involved, the typical characteristics and the ongoing developments will be discussed. Finally, the roadmap for the 3D-integration in IMEC will be presented.

Keywords

microelectronicsmicroelectro-mechanical (MEMS)thin film
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 970: Symposium Y – Enabling Technologies for 3-D Integration , 2006 , 0970-Y01-02
Copyright
Copyright © Materials Research Society 2007

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References

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