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Reliability in Mechatronics Systems from TEM, SEM and SE Material Analysis

  • Pierre Dahoo (a1), Nadim Alayli (a2), Armelle Girard (a3), Philippe Pougnet (a4), Ky-Lim Tan (a5) and Jean-Michel Morelle (a6)...


Mechatronic systems designed to comply to new EU directives are studied through interconnections by electronic or photonic probes, SEM, TEM, SE or 3D Tomography. Leaded and lead free modules assembled by standard interconnection technologies are studied for robustness relative to thermal accelerated life tests. Results obtained from JEOL 6060LV SEM and Optical Microscopy show that although slow growth rate of inter-metallics (IMC) is consistent with expected reliability, they are responsible for propagation of cracks especially in the presence of gold on PCB side. Innovative Low Temperature Joining (LTJ) technology applied to nano or micro silver pastes which should reduce IMC effects are tested on mechatronic systems. Results obtained from SEM, TEM and 3D Tomography will be shown as well as non destructive Spectroscopic Ellipsometry studies of samples. Pressureless LTJ technology is unsuitable for robust interconnection.



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2. Coquery, G., Morelle, J.M. and Trias, D., Packaging of active power switching modules: a review in the context of automotive applications, Proceedings of the 1st International Conference Automotive Power Electronics (APE), France, June 2006
3. Khabir, Z., Lefevre, S., Richardeau, F., Reliability challenges of power electronics modules in automotive environment, Sensors and Actuators for advanced automotive applications (SENSACT) conference, ESIEE SIA Sponsor, France, December 2005
4. Zhang, Z.Z, Bai, J., Lu, G-Q, Yin, J., Wyk, J.D. Van, Liang, Z., Zhu, L. and Chow, T.P., Low-Temperature Sintering Nanoscale Silver Paste as an High Temperature Packaging Solution; Proceedings of the Int. Conf..on Power Electronics (CPES) USA, April 2005



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