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Selected Composites for High Field Magnets

Published online by Cambridge University Press:  26 February 2011

Ke Han ,
Jingping Chen ,
Baozhi Cui ,
Charney A Davy  and
Peter N Kalu
Ke Han
Affiliation:
han@magnet.fsu.edu, Nationa High Magnetic Field Laboratory, Magnet Science and Technology, 1800 E. Paul Dirac Drive, Tallahassee, FL, 32309, United States
Jingping Chen
Affiliation:
chen@magnet.fsu.edu, Florida State University, National High Magnetic Field Laboratory, Tallahassee, FL, 32301, United States
Baozhi Cui
Affiliation:
bcui@magnet.fsu.edu, Florida State University, National High Magnetic Field Laboratory, Tallahassee, FL, 32301, United States
Charney A Davy
Affiliation:
davy@magnet.fsu.edu, Florida State University, National High Magnetic Field Laboratory, Tallahassee, FL, 32301, United States
Peter N Kalu
Affiliation:
kalu@magnet.fsu.edu, Florida State University, National High Magnetic Field Laboratory, Tallahassee, FL, 32301, United States
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Abstract

The national high magnetic field laboratory builds and uses various highfield magnets for fundamental research. In building high field magnets, avariety of high strength composites are required because of the Lorentzstresses generated by high field exceeding the strength of most of thematerials, particular conductors. For example, a field of 60 T can generatea magnetic pressure that corresponds to a stress in the conductor of 1.5GPa, which is at the limit of known conducting materials with conductivityhigher than 70% International Annealed Copper Standard and sizes suitablefor building high field magnets. The design of high field magnets is limitedby these forces and, consequently, by the available materials. At the sametime, the materials need to have excellent physical properties. Forinstance, the conductors need to have high electrical conductivity and highspecific heat and the superconductors should have high critical current infield and low alternative current losses. This paper outlines ourrequirements and research on metal matrix composite materials for buildinghigh field magnets. The discussions include both the macrocomposite andmicrocomposite. The scales of the structures in the composites are frommillimeters to nanometers.

Keywords

compositestrengthstress/strain relationship

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References

[1] Wood, J.T., Embury, , , J.D. and Ashby, M., Acta Mater., 45(3) (1997) 1099.10.1016/S1359-6454(96)00220-0Google Scholar
[2] Van Cleemput, M., Jones, H., Van der Burgt, M., Barrau, J-R., Lee, J.A., Eyssa, Y., and Schneider-Muntau, H.-J., Physica B, 216 (1996) 226. [3 ]Pernambuso-Wise, P, in High Magnetic Fields, Applications, Generation, Materials, ed. Schneider-Muntau, H.-J., World Scientific, NJ, USA, (1997), pp.37110.1016/0921-4526(95)00478-5Google Scholar
[4] Frings, P.H, Vanbockstal, L, Physica B, 211(1–4) (1995) 73.10.1016/0921-4526(94)00947-TGoogle Scholar
[5] Baca, A., Coe, H., Han, K., Embury, J. D., Kihara, K., Li, L., Schillig, J., Sims, J., Walsh, R., IEEE Transactions on Applied Superconductivity, this issue.Google Scholar
[6] Embury, J.D. and Han, K., “Conductor Materials for High Field Magnets”, Current Opinions in Solid State and Materials Science, 3(3), 304–308 (1998).10.1016/S1359-0286(98)80106-XGoogle Scholar
[7] Brandao, L., Han, K., Embury, J. D., Walsh, R., Toplosky, V. and VanSciver, S, IEEE Transactions of Applied Superconductivity, 10 (1) 1282–1287 (2000).10.1109/77.828470Google Scholar
[8] Han, K., Walsh, R.P., Ishmaku, A., Toplosky, V., and Embury, J. D., Phil. Mag., 84 (34), 3705–3716, (2004).10.1080/14786430412331293496Google Scholar
[9] Zhao, Y.H.; Bingert, J.F.; Liao, X.-Z.; Cui, B.-Z.; Han, K.; Sergueeva, A.V.; Mukherjee, A.K.; Valiev, R.Z.; Langdon, T.G. and Zhu, Y.T., Simultaneously Increasing the Ductility and Strength of Ultra-Fine-Grained Pure Copper, Adv. Mater., 18, 2949–2953 (2006)Google Scholar
[10] Wang, Y M, Ma, E, Valiev, R Z, Zhu, Y T, Advanced Materials, 16 (4): 328-+ FEB 17 2004.10.1002/adma.200305679Google Scholar
[11] Cheng, S., Ma, E., Wang, Y. M., Kecskes, L., Youssef, K. M., Koch, C.C., Trociewitz, U. P. and Han, K., Acta Materialia, 53(5), 1521–1533, (2005).10.1016/j.actamat.2004.12.005Google Scholar
[12] Frommeyer, G. and Wassermann, G. Physica Status Solidi (a) 27, pp.99–105, 1975.10.1002/pssa.2210270112Google Scholar
[13] Frommeyer, G. and Wassermann, G., Acta Metall, vol. 23, 1975, pp. 1353.10.1016/0001-6160(75)90144-3Google Scholar
[14] Spitzig, W. A., Pelton, A. R., and Laabs, F. C. Acta Metallurgica et Materialia 35(10), pp.2427–2442, 1987.10.1016/0001-6160(87)90140-4Google Scholar
[15] Bevk, J, Harbson, J P, Bell, J L, J Applied Physics 49 (12): 6031–6038 1978 10.1063/1.324573Google Scholar
[16] Han, K., Lawson, A.C., Wood, J.T., Embury, J.D., Von Dreele, R. B. and Richardson, J. W. Jr, “Microstructure and Internal Stresses in Cold-deformed Cu-Ag and Cu-Nb Wires”, Phil. Mag., 84(24), 2579–2593 (2004).10.1080/14786430410001689981Google Scholar
[17] Klassen, R J, Conlon, K T, Wood, J T, Scripta Materialia 48 (4): 385–389 FEB 17 2003 10.1016/S1359-6462(02)00452-9Google Scholar
[18] Ohsaki, S, Yamazaki, K, Hono, K, Scripta Materialia 48 (12): 1569–1574 JUN 2003 Google Scholar
[19] Sauvage, X, Thilly, L, Blavette, D, J. Dd Physique IV 11 (PR4): 27–32 SEP 2001 Google Scholar
[20] Sauvage, X, Renaud, L, Deconihout, B, Blavette, D, Ping, D H, Hono, K, ACTA MATERIALIA 49 (3): 389–394 FEB 8 2001 10.1016/S1359-6454(00)00338-4Google Scholar
[21] Funkenbusch, P D, Courtney, T H, Acta Metallurgica 33 (5): 913–922 1985 10.1016/0001-6160(85)90116-6Google Scholar
[22] Heringhaus, F, Schneider-Muntau, H J, Gottstein, G, Materials Science and Engineering A, 347 (1–2): 9–20 APR 25 2003 10.1016/S0921-5093(02)00590-7Google Scholar
[23] Hangen, U, Raabe, D, Acta Metallurgica et Materialia, 43 (11): 4075–4082 NOV 1995 10.1016/0956-7151(95)00079-BGoogle Scholar
[24] Raabe, D, , Heringhaus, Hangen, U, Gottstein, G, Zeitchrift Metallkunde E 86 (6): 405–415 JUN 1995 Google Scholar
[25] Han, K, Vasquez, A A, Xin, Y, Kalu, P N, Acta Materialia, 51 (3): 767–780 FEB 7 2003 10.1016/S1359-6454(02)00468-8Google Scholar
[26] Thilly, L, Veron, M, Ludwig, O, Lecouturier, F, Peyrade, J P, Askenazy, S, Philosophical Magazine, 82 (5): 925–942 MAR 2002 10.1080/01418610208240010Google Scholar
[27] Han, K, Embury, J D, Sims, J R, Campbell, L J, Schneider-Muntau, H J, Pantsyrnyi, V I, Shikov, A, Nikulin, A, Vorobieva, A, Materials Science and Engineering 267 (1): 99–114 JUL 15 1999 10.1016/S0921-5093(99)00025-8Google Scholar
[28] Sakai, Y, Inoue, K, Asano, T, Wada, H, Maeda, H, Applied Physics Letters, 59 (23): 2965–2967, 1991 10.1063/1.105813Google Scholar
[29] Liu, J B, Zhang, L, Meng, L, Acta Materialia Sinica, 42 (9): 937–941 SEP 2006 Google Scholar
[30] Liu, J B, Meng, L, Zeng, Y W, Materials Science and Engineering A, 435: 237–244 NOV 5 2006 10.1016/j.msea.2006.07.125Google Scholar
[31] Hong, S I, Hill, M A, J Materials Science 37 (6): 1237–1245 MAR 15 2002 Google Scholar
[32] Sinclair, C W, Embury, J D, Weatherly, G C, Conlon, K T, Philosophical Magazine 85 (26–27): 3137–3156 SEP 2005 10.1080/14786430500155064Google Scholar
[33] Choi, Y, Song, M S, Lee, K L, Hong, S I, Nanaomaterials by Severe Plastic Deformation Materials Forum, 503–504: 901–906 2006 Google Scholar
[34] Ge, J P, Zhao, H, Yao, Z Q, Transactions Nonferrous Metals Society of China 15 (3): 553–559 JUN 2005 Google Scholar
[35] Yao, Z., Ge, J., Liu, S, J Materials Science, 41 (12): 3825–3829 JUN 2006 10.1007/s10853-006-7941-5Google Scholar
[36] Vidal, V, Thilly, L, Lecouturier, F, Renault, P O, Acta Materialia, 54 (4): 1063–1075 FEB 2006 10.1016/j.actamat.2005.10.031Google Scholar
[37] Raabe, D, Miyake, K, Takahara, H, Materials Science and Engineering A 291 (1–2): 186–197 OCT 31 2000 10.1016/S0921-5093(00)00981-3Google Scholar
[38] Raabe, D, Ge, J, Scripta Materialia 51 (9): 915–920 NOV 2004 10.1016/j.scriptamat.2004.06.016Google Scholar
[39] Gao, H Y, Wang, J, Shu, D, Sun, B D, Scripta Materialia 53 (10): 1105–1109 NOV 2005 10.1016/j.scriptamat.2005.07.028Google Scholar
[40] Song, J S, Hong, S I, Kim, H S, J Materials Processing Technology, 113 (1–3): 610–616 JUN 15 2001 10.1016/S0924-0136(01)00665-3Google Scholar
[41] Gaganov, A., Freudenberger, J., Botcharova, E., Schultz, L., Materials Science and Engineering A, 437 (2): 313–322 NOV 15 2006 10.1016/j.msea.2006.07.121Google Scholar
[42] Popova, E N, Popov, V V, Romanov, E P, Rodionova, L A, Sudareva, S V, Khlebova, N E, Pantsyrnyi, V I, Shikov, A K, Vorob'eva, A E, Physics Metals and Metallography 94 (1): 73–81 JUL 2002 Google Scholar
[43] Mattissen, D, Raabe, D, Heringhaus, F, Acta Materialia 47 (5): 1627–1634 MAR 31 1999 10.1016/S1359-6454(99)00026-9Google Scholar
[44] Popova, E N, Popov, V V, Rodionova, L A, Romanov, E P, Sudareva, S V, Hlebova, N E, Pantsyrny, V I, Shikov, A K, Vorobieva, A E, Scripta Materialia 46 (3): 193–198 FEB 1 2002 Google Scholar
[45] Pantsyrnyi, V, Shikov, A, Vorobieva, A, Khlebova, N, Potapenko, I, Silaev, A, Beliakov, N, Vedernikov, G, Gubkin, I, Salunin, N, Kozlenkova, N, Polikarpova, M, IEEE Trans. Appl. Supercond. 10 (1): 1263–1268 MAR 2000 10.1109/77.828465Google Scholar
[46] Spencer, K, Lecouturier, F, Thilly, L, Embury, J D, Advanced Engineering Materials 6 (5): 290–297 MAY 2004 10.1002/adem.200400014Google Scholar
[47] Ekin, J W, CRYOGENICS 35: S25-S28 Suppl. S 1995 Google Scholar
[48] Arai, K, Tateishi, H, Umeda, M, Agatsuma, K, Takizawa, S, IEEE Trans. Magnetics 30 (4): 2164–2167 Part 2, JUL 1994 10.1109/20.305700Google Scholar
[49] Ekin, J W, APPLIED PHYSICS LETTERS 29 (3): 216–219 1976 10.1063/1.88999Google Scholar
[50] Ekin, J W, CRYOGENICS 20 (11): 611–624 1980 Google Scholar
[51] Miyoshi, K, Endoh, S, Meguro, S, Nishijima, G, Awaji, S, Watanabe, K, IEEE Trans. Appl. Supercond. 14 (2): 1004–1007 Sp. Iss. SI, JUN 2004.Google Scholar
[52] Awaji, S, Oguro, H, Nishijima, G, Watanabe, K, Katagiri, K, Miyoshi, K, Meguro, S, IEEE Trans. Appl. Supercond. 14 (2): 983–986 Sp. Iss. SI, JUN 2004.Google Scholar
[53] Iwaki, G, Sato, J, Katagiri, K, Watanabe, K, IEEE Trans. Appl. Supercond. 11 (1): 3631–3634 Part 3, MAR 2001.10.1109/77.919851Google Scholar
[54] Iwasaki, S, Goto, K, Sadakata, N, Saito, T, Kohno, O, IEEE Trans. Magnetics 32 (4): 2566–2569 Part 1, JUL 1996 10.1109/20.511397Google Scholar
[55] Sakamoto, H, Higuchi, M, Endoh, S, Nagasu, Y, Kimura, A, Wada, K, Meguro, S, Ikeda, M, IEEE Trans. Appl. Supercond. 10 (1): 1008–1011 MAR 2000 10.1109/77.828402Google Scholar
[56] Murase, S, Nakayama, S, Masegi, T, Koyanagi, K, Nomura, S, Shiga, N, Kobayashi, N, Watanabe, K, J Japan Institute of Metals 61 (9): 801–806 SEP 1997.10.2320/jinstmet1952.61.9_801Google Scholar
[57] Chen, J.; Han, K.; Kalu, P.N. and Markiewicz, W.D., IEEE Trans. Appl. Supercond., 15 (2), 3568–3571 (2005).Google Scholar