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SI3N4 Particle Removal Efficiency Study

  • Jane Qian Liu (a1), Carolyn Lee (a2), Joseph M. Rosamilia (a3), Tom Boone (a3), Veronica Czitrom (a1) and Gregg S. Higashi (a1)...
Abstract
ABSTRACT

Controlling particle contamination in wafer cleaning is important to reduce defect density and improve device performance and yield. In this study, a screening experiment was employed to evaluate particle removal efficiency among different cleanings, including FSI BCLN, bench rinse and dry only, bench SC1/megasonic only, bench RCA cleaning, and bench RCA-based cleaning. To optimize particle removal efficiency in RCA-based cleaning, a design of experiment (DOE) has been done to investigate the impact of SC1/megasonic cleaning on Si3N4 particle removal efficiency. Bath temperature, megasonic power, and solution chemistry of SCI bath were evaluated. The removal efficiency in relations to particle sizes was also investigated

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References
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MRS Online Proceedings Library (OPL)
  • ISSN: -
  • EISSN: 1946-4274
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