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Simple Computer Modeling of the Grain Microstructure of Al-4wt%Cu Interconnection Lines

Published online by Cambridge University Press:  10 February 2011

K.S. Low ,
S.J. Bull  and
A.G. O'Neill
K.S. Low
Affiliation:
Department of Electrical and Electronic Engineering
S.J. Bull
Affiliation:
Department of Mechanical, Materials and Manufacturing Engineering, University of Newcastle upon Tyne, Newcastle upon Tyne, NEI 7RU, U.K.
A.G. O'Neill
Affiliation:
Department of Electrical and Electronic Engineering
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Abstract

A simple computer model is proposed to simulate the microstructural evolution of Al-4wt%Cu lines. The model includes the coarsening and pinning of Al2Cu precipitates which occur during normal grain growth. This model is used to explore how Cu-rich precipitates evolve during normal grain growth, and how they affect the evolution of grain structure from polycrystalline to bamboo.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 472: Symposium I – Polycrystalline Thin Films - Structure, Texture, Properties..III , 1997 , 191
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCES

[1] Thompson, C.V., Annu Rev Mater. Sci., 20, 245–268 (1990).Google Scholar
[2] Jieng, H. and Faulkner, R.G., Acta Mater., 44 (5), 1857–1864 (1996).Google Scholar
[3] Aaron, H.B and Aaronson, H.I., Acta Metallurgica, 16, 789–798 (1968).Google Scholar
[4] Frost, H.J. and Thompson, C.V., Current Opinion in Solid State & Materials Science, 1, 361–368 (1996).Google Scholar
[5] Anderson, M.P., Srolovitz, D.J., Grest, G.S., Acta Metall Mater., 32, 793–802, (1984).Google Scholar
[6] Frost, H.J., Thompson, C.V., J. Electron Mater., 17, 447–458, (1988).Google Scholar
[7] Fullman, R.L., American Society for Metals, 1952, 179–207.Google Scholar