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Simulation of Electromigration Effects on Voids in Monocrystalline Ag

Published online by Cambridge University Press:  07 June 2012

Andreas Latz  and
Dietrich E. Wolf
Andreas Latz
Affiliation:
Department of Physics and Center for Nanointegration Duisburg-Essen (CeNIDE), University of Duisburg-Essen, D-47057 Duisburg, Germany
Dietrich E. Wolf
Affiliation:
Department of Physics and Center for Nanointegration Duisburg-Essen (CeNIDE), University of Duisburg-Essen, D-47057 Duisburg, Germany
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Abstract

Understanding electromigration effects in monocrystalline metal becomes of increasing interest with decreasing width and thickness of interconnects. Using a three-dimensional, atomistic model based on the Kinetic Monte Carlo method, we investigate voids in monocrystalline silver. Subject to electromigration, voids begin to drift. We show that the drift velocity not only depends on the void size, but also on the electromigration force direction, with respect to the crystallographic orientation.

Keywords

electromigrationsimulationdiffusion

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References

REFERENCES

1. Sorbello, R. S., Solid State Phys. 51, 159 (1997).Google Scholar
2. Tan, C. M. and Roy, A., Mater. Sci. Eng. R 58, 1 (2007).Google Scholar
3. Ho, P. S., J. Appl. Phys. 41, 64 (1970).Google Scholar
4. Latz, A., Sindermann, S., Brendel, L., Dumpich, G., Meyer zu Heringdorf, F.-J., and Wolf, D. E., Phys. Rev. B 85, 035449 (2012).Google Scholar
5. Voter, A. F., Phys. Rev. B 34, 6819 (1986).Google Scholar
6. Cleri, F. and Rosato, V., Phys. Rev. B 48, 22 (1993).Google Scholar
7. Huang, Z.-H. and Allen, R. E., J. Vac. Sci. Technol. A 9, 876 (1991).Google Scholar
8. Wen, Y. and Zhang, J., Solid State Commun. 144, 163 (2007).Google Scholar
9. Tao, C., Cullen, W. G., and Williams, E. D., Science 328, 736 (2010).Google Scholar