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Stress, Microstructure and Magnetic Properties of Thin Sputtered Co Alloy Films

Published online by Cambridge University Press:  15 February 2011

C. A. Ross ,
R. Ranjan  and
J. Chang
C. A. Ross
Affiliation:
Komag Inc., 275 S. Hillview Drive, Milpitas, CA 95035
R. Ranjan
Affiliation:
Komag Inc., 275 S. Hillview Drive, Milpitas, CA 95035
J. Chang
Affiliation:
Komag Inc., 275 S. Hillview Drive, Milpitas, CA 95035
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Abstract

The internal stress and magnetic properties have been measured for cobalt alloy films deposited using a range of sputter conditions. The sputter conditions affect the internal stress and the microstructure, both of which contribute to the magnetic properties of the films. Stress influences the magnetic properties via magnetostriction, while the microstructural effect on coercivity comes primarily from the degree of separation and size of the grains in the film. The effect of stress on coercivity was investigated separately by applying external stresses to the films, and magnetostriction coefficients were derived for different alloys. The change in coercivity with sputter parameters indicates that in alloys such as Co77Ni7Cr4Pt12, the microstructure has the dominant effect on coercivity.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 343: Symposium H – Polycrystalline Thin Films - Structure, Texture, Properties and Applications , 1994 , 315
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

(1) Nolan, T.P., Sinclair, R., Ranjan, R. and Yamashita, T., J. Appl. Phys. 73(10) 5117 (1993)CrossRefGoogle Scholar
(2) Yamashita, T., Chan, L.H., Fujiwara, T. and Chen, T., I.E.E.E. Trans. Mag. 27(6) 4727 (1991)CrossRefGoogle Scholar
(3) Thornton, J.A. and Hoffman, D.W., J. Vac. Sci. Technol. 14, 164 (1977)CrossRefGoogle Scholar
(4) Chen, T. and Yamashita, T., I.E.E.E. Trans. Mag. 24(6) 2700 (1988)CrossRefGoogle Scholar
(5) Doerner, M.F., Wang, P.-W., Mirzamaani, S.M. and Parker, D.S., Proc. Mater. Res. Soc. 232 27 (1991)CrossRefGoogle Scholar
(6) Mirzamaani, M., Johnson, K., Edmonson, D., Ivett, P. and Russak, M., J. Appl. Phys. 67(9) 4695 (1990)CrossRefGoogle Scholar
(7) Simpson, E.M., Narayan, P.B., Swami, G.T.K. and Chao, J.L., I.E.E.E. Trans. Mag. 23(5) 3405 (1987)CrossRefGoogle Scholar
(8) Kawamoto, A. and Hikami, F., J. Appl. Phys. 69(8) 5151 (1991)CrossRefGoogle Scholar
(9) Mauri, D., Speriosu, V.S., Yogi, T., Castillo, G. and Peterson, D.T., I.E.E.E. Trans. Mag. 26(5) 1584 (1990)CrossRefGoogle Scholar
(10) Aboaf, J.A., Herd, S.R. and Klokholm, E., I.E.E.E. Trans. Mag. 19(4) 1514 (1983)CrossRefGoogle Scholar
(11) Zhu, J-G., I.E.E.E. Trans. Mag. 29(1) 195 (1993)CrossRefGoogle Scholar