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Surface Cross-Hatched Morphology on Strained III-V Semiconductor Heterostructures

Published online by Cambridge University Press:  28 February 2011

Kevin H. Chang
Affiliation:
Present address: Motorola Inc., Phoenix, AZ 85062-2953
Ronald Gibala
Affiliation:
Departments of Materials Science and Engineering and Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI 48109
David J. Srolovitz
Affiliation:
Departments of Materials Science and Engineering and Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI 48109
Pallab K. Bhattacharya
Affiliation:
Departments of Materials Science and Engineering and Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI 48109
John F. Mansfield
Affiliation:
Departments of Materials Science and Engineering and Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI 48109
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Abstract

The correlation between surface cross-hatched morphology and interfacial misfit dislocations in strained III-V semiconductor heteroepitaxy has been studied. The surface pattern is clearly seen on samples grown at high temperature (520°C) and with lattice mismatch f < 2%. A poorly defined cross-hatched morphology is found on layers grown at low temperature (400°C). For f > 2%, a rough textured surface morphology is observed in place of cross hatching. Few threading dislocations are observed in the strained layer when cross hatch develops. Cross hatch occurs after most interfacial misfit dislocations are generated. The results suggest that surface cross hatch is directly related to the generation and glide of interfacial misfit dislocations.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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References

1Osburn, G.C., J. Vac. Sci. Technol. B 1, 379 (1983).Google Scholar
2Burmeister, R.A., Pighini, G.P. and Greene, P.E., Trans. TMS-AIME 245, 587 (1969).Google Scholar
3Kishino, S., Ogirima, M. and Kurata, K., J. Electrochem. Soc. 119, 618 (1972).Google Scholar
4Olsen, G.H., J. Crys. Growth 31, 223 (1975).Google Scholar
5Matthews, J.W. and Blakeslee, A.E., J. Crys. Growth 29, 273 (1975).Google Scholar
6Woodall, J.M., Kirchner, P.D., Rogers, D.L. and Chisholm, M., in Proc. IEEE/Cornell Conf., edited by Frensley, W.R., IEEE Cat. No. 87CH2526-2, August 10–12 1987.Google Scholar
7Matthews, J.W., Blakeslee, A.E. and Mader, S., Thin Solid Films 33, 253 (1976).Google Scholar
8Burger, P.R., Chang, K., Bhattacharya, P., Singh, J. and Bajaj, K.K., Appl. Phys. Lett. 53, 684 (1988).Google Scholar
9Kiely, C.J., Chyi, J.-I., Rockett, A. and Morkoc, H., Abst. Mat. Res. Soc. Fall Meeting, p. 470, 1988.Google Scholar
10Matthews, J.W. and Blakeslee, A.E., J. Cryst. Growth 27, 118 (1974).Google Scholar