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Technique for Monitoring the Etching Rate of Alumina

Published online by Cambridge University Press:  15 March 2011

B. Deb ,
A. Altay ,
S. R. Gilliss ,
N.E. Munoz  and
C. B. Carter
B. Deb
Affiliation:
Department of Chemical Engineering and Material Science University of Minnesota, Minneapolis, MN 55455-0132
A. Altay
Affiliation:
Department of Chemical Engineering and Material Science University of Minnesota, Minneapolis, MN 55455-0132
S. R. Gilliss
Affiliation:
Department of Chemical Engineering and Material Science University of Minnesota, Minneapolis, MN 55455-0132
N.E. Munoz
Affiliation:
Department of Chemical Engineering and Material Science University of Minnesota, Minneapolis, MN 55455-0132
C. B. Carter
Affiliation:
Department of Chemical Engineering and Material Science University of Minnesota, Minneapolis, MN 55455-0132
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Abstract

The effect of chemical and thermal treatments on the grains and grain boundaries of polycrystalline μ-Al2O3 has been examined using a combination of microscopy techniques. Commercially available alumina samples (Lucalox™) were chemically etched in phosphoric acid at 200°C in increments of 15 min. Thermal treatments were carried out at 1650°C before chemical treatments. Using maps obtained by visible-light microscopy (VLM) as a guide, the same regions were re-examined using atomic force microscopy (AFM) after subsequent treatments. Variations in the dissolution rates of different grains and grain boundaries could then be studied using AFM. The geometry of the grain-boundary grooves was compared after thermal and chemical treatments. Electron backscattered diffraction (EBSD) patterns recorded in the scanning electron microscope (SEM) were used to obtain crystallographic orientations of the grains which enabled variations in dissolution rates between grains to be correlated to orientation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 819: Symposia N/P – Interfacial Engineering for Optimized Properties III , 2004 , N3.11
Copyright
Copyright © Materials Research Society 2004

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References

1. Alumina Chemicals: Science and Technology Handbook, American Ceramic Society, Westerville, Ohio (1990).Google Scholar
2. Heffelfinger, J.R., Bench, M.W. and Carter, C.B.. Surf. Sci. 1997;370: L168.Google Scholar
3. Heffelfinger, J.R. and Carter, C.B.. Surf. Sci. Lett. 1995;343: L1161.Google Scholar
4. Susnitzky, D.W. and Carter, C.B.. J. Am. Ceram. Soc. 1990;73: 2485.Google Scholar
5. Ramamurthy, S., Hebert, B.C. and Carter, C.B.. Phil. Mag. Lett. 1995;72: 269.Google Scholar
6. Munoz, N.E., Gilliss, S.R. and Carter, C.B.. Phil. Mag. Lett. 2004;84: 21.Google Scholar
7. Saylor, D.M. and Rohrer, G.S.. J. Am. Ceram. Soc. 1999;82: 1529.Google Scholar
8. Zhou, B. and Ramirez, W.F.. J. Electrochem. Soc. 1996;143: 619.Google Scholar
9. Lichtenberger, A.W., Lea, D.M., Lloyed, F.L.. IEEE Trans. Appl. Supercond. 1993;3: 2191.Google Scholar
10. Frieser, R.G.. J. Electrochem. Soc. 1966;113: 357.Google Scholar
11. Gignac, L.M. and Risbud, S.H.. Thin Solid Films 1991;202: 83.Google Scholar
12. White, L.K.. Thin Solid Films 1981;79: L73.Google Scholar
13. Bothe, J.V. and Brown, P.W.. J. Am. Ceram. Soc. 1993;76: 2353.Google Scholar
14. Sarkar, N. and Sadan, A.. (2001), Board of Supervisors of Louisiana State University (Baton Rouge, LA).Google Scholar
15. Farrer, J.K., Michael, J.R. and Carter, C.B.. Electron Backscatter Diffraction in Materials Science, Kluwer Academic/Plenum Publishers (2000): 299.Google Scholar
16. Randle, V. and Dingley, D.. Scripta Metall. 1989;23: 1565.Google Scholar
17. Michael, J.R.. Microsc. Microanal. 1999;5 (suppl.2): 832.Google Scholar
18. Adams, B.L., Wright, S.I. and Kunze, K.. Metall. Trans. A 1993;24A: 819.Google Scholar
19. Shin, W., Seo, W.-S. and Koumoto, K.. J. Eur. Ceram. Soc. 1998;18: 595.Google Scholar
20. Gaddipati, A.R. and Scott, W.D.. J. Mater. Sci. 1986;21: 419.Google Scholar
21. Venables, J.A. and Harland, C.J.. Phil. Mag. 1973 27: 1193.Google Scholar
22. Venables, J.A. and Jaya, R.B.. Phil. Mag. 1977;35: 1317.Google Scholar
23. Schacht, M., Boukis, N. and Dinjus, E.. J. Mater. Sci. 2000;35: 6251.Google Scholar