Hostname: page-component-6766d58669-nqrmd Total loading time: 0 Render date: 2026-05-19T00:44:52.061Z Has data issue: false hasContentIssue false
  • English
  • Français

Technology for Microassembling

Published online by Cambridge University Press:  15 February 2011

S. Johansson
S. Johansson*
Affiliation:
Department of Technology, Uppsala University, Box 534, 751 21 Uppsala, Sweden, Stefan.Johanssoii@teknikum.uu.se
Get access

Abstract

The various problem areas regarding assembling of microelements into complex microsystems are reviewed and the joining techniques are emphasised in particular. The dis,-ussion is focused on the fabrication of microrobotic systems and the various joining techniques are compared with respect to the potential of fulfilling the demands for such a process. Factor.; such as processing conditions, precision, stability, materials limitations, bond and device strength are included in the comparison. Different methods for handling and manipulating microelements are discussed and the experimental equipment used in our own investigations is presented.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 444: Symposium I – Materials for Mechanical and Optical Microsystems , 1996 , 3
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

1. Yeh, H.-J.J. and Smith, J.S., Proc. Micro Electro Mechanical systems, Oiso, Japan (1994) 279–84.Google Scholar
2. Rambin, C.L. and Warrington, R.O., Proc. Micro Electro Mechanical Systems, Oiso, Japan (1994) 285–90.Google Scholar
3. Koyano, K. and Sato, T., IEEE Int. Conf. Robotics and Automation, Minneapolis, MN, USA (1996) 2541–8.Google Scholar
4. Tiensuu, A.-L., Schweitz, J.-Å., and Johansson, S., Proc. Transducers, Stockholm, Sweden (1995) 236–9.Google Scholar
5. Thornell, G., Bexell, M., Schweitz, J.-Å., and Johansson, S., Proc. Transducers, Stockholm, Sweden (1995) 388–91.Google Scholar
6. Tiensuu, A.-L., Bexell, M., Smith, L., Schweitz, J.-Å., and Johansson, S., Sensors and Actuators 45 (1994) 227–236.Google Scholar
7. Strandman, C. and Bäcklund, Y., J. Micro Electro Mechanical Systems (in press)Google Scholar
8. Bexell, M. and Johansson, S., SPIE Symp. Intelligent Systems and Advanced manufacturing, Boston, MA, USA (1996)Google Scholar
9. Maas, D., Fahrenberg, J., Keller, W., Mihalj, D., and Seidel, D., Proc. Micro Systems Technologies, Berlin, Germany (1994) 481–90.Google Scholar
10. Dom, L., Feinwerktechnik und Messtechnik 90 (1982) 6.Google Scholar
11. Lau, J.L., Flip-chip Technologies,, Lau, J.H., Editor. 1995, McGraw-Hill: p. 86–121.Google Scholar
12. Ljungberg, K., Söderbärg, A., Tiensuu, A.-L., Johansson, S., Thungström, G., and Petersson, C.S., J. Electrochem. Soc. 141 (1994) 2829–33.Google Scholar
13. Suga, T. and Hosoda, N., Proc. Micro Electro Mechanical System, Amsterdam, The Netherlands (1995) 413–18.Google Scholar
14. Johansson, S., Gustafsson, K., and Schweitz, J.-Å., Sensors and Materials 3 (1988) 143–151.Google Scholar
15. Johansson, S., Gustafsson, K., and Schweitz, J.-Å., Sensors and Materials 4 (1988) 209–221.Google Scholar
16. Lasky, J.B., Stiffler, S.R., White, F.R., and Abemathey, J.R.,, in IEDM Tech. Dig. 1985, IEEE: New York. p. 684.Google Scholar
17. Steinkirchner, J., Martini, T., Reiche, M., and Gösele, U., Proc. Third Int. Symp. Semiconductor Wafer Bonding: Physics and Applications., Reno, NV, USA (1995) 138–46.Google Scholar
18. Bäcklund, Y., Ljungberg, K., and Söderbärg, A., J. Micromech. Microeng. 2 (1992) 158–60.Google Scholar