Hostname: page-component-8448b6f56d-gtxcr Total loading time: 0 Render date: 2024-04-19T05:47:42.970Z Has data issue: false hasContentIssue false
  • English
  • Français

Thermodynamics and Kinetics of Oxidation of Pure Indium Solders

Published online by Cambridge University Press:  26 February 2011

Harry Schoeller ,
Jongman Kim ,
Seungbae Park  and
Junghyun Cho
Harry Schoeller
Affiliation:
harryerich.schoeller@gmail.com, SUNY at Binghamton, Mechanical Engineering, Vestal Pkwy East, Binghamton, NY, 13902-6000, United States
Jongman Kim
Affiliation:
jmkim@binghamton.edu, SUNY at Binghamton, Mechanical Engineering, Vestal Pkwy East, Binghamton, NY, 13902-6000, United States
Seungbae Park
Affiliation:
sbpark@binghamton.edu, SUNY at Binghamton, Mechanical Engineering, Vestal Pkwy East, Binghamton, NY, 13902-6000, United States
Junghyun Cho
Affiliation:
jcho@binghamton.edu, SUNY at Binghamton, Mechanical Engineering, Vestal Pkwy East, Binghamton, NY, 13902-6000, United States
Get access

Abstract

MicroElectroMechanical System (MEMS) devices often require low-temperature, fluxless soldering techniques due to their high temperature sensitivity and performance requirements of the components. While seeking the development of a soldering technology using pure indium, the major focus of this study is to assess the thermodynamics and kinetics of indium oxidation at various solder reflow environments that will ultimately provide a processing window for solder reflow and surface oxide cleaning. With a glove box employed to generate reducing environments, oxygen, moisture, and hydrogen contents were varied to examine their effects on oxidation and reduction behavior of indium. We also explored oxidation mechanisms at different regimes of temperature and time. In particular, electron transport from indium to indium oxide is shown to be the rate controlling mechanism under specific oxidizing conditions. For accurate thickness measurements, a spectroscopic ellipsometer was employed. In addition, the effect of indium oxidation on solder joint reliability was observed via wetting angle and interfacial shear strength measurements.

Keywords

oxidationsolderingpackaging
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 968: Symposium V – Advanced Electronic Packaging , 2006 , 0968-V03-07
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Wable, G., Chu, Q., Damodaran, P., Srihari, K., Soldering & Surface Mount Technology 17/2, 32–39, (2005).Google Scholar
2. Humpston, G., Jacobson, D., Advanced Materials & Processes vol:163 iss:4 pg:45–47 (2005)Google Scholar
3. Mil'shtein, S., Parsey, J. Jr, Lang, D., Joy, D., and Temkin, H., IEEE Trans. Comp, Pac. Man. Tech. 8, 397, (1985).Google Scholar
4. So, W., Lee, C., IEEE Trans. Comp, Pac. Man. Tech. Vol.23, No.2, (2000)Google Scholar
5. Kubaschewski, O., Hopkins, B., Oxidation of Metals and Alloys (2nd Edition). New York, Academic Press Inc. (1962).Google Scholar
6. Gaskell, D., Introduction to the Thermodynamics of Materials (4th edition). New York, Taylor & Francis, (2003).Google Scholar
7. Uhlig, H., Acta Metallurgica, Vol. 4, 541, (1956)Google Scholar
8. Geller, J., Engle, P., J. Res. Natl. Inst. Stand. Technol. 107. 627–638 (2002).Google Scholar