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Ultrafast Laser Processing for Lab-on-a-Chip Device Manufacture

Published online by Cambridge University Press:  01 February 2011

Koji Sugioka ,
Ya Cheng  and
Katsumi Midorikawa
Koji Sugioka
Affiliation:
RIKEN —The Institute of Physical and Chemical Research Wako, Saitama 351–0198, Japan
Ya Cheng
Affiliation:
RIKEN —The Institute of Physical and Chemical Research Wako, Saitama 351–0198, Japan
Katsumi Midorikawa
Affiliation:
RIKEN —The Institute of Physical and Chemical Research Wako, Saitama 351–0198, Japan
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Abstract

3D microstructuring of photosensitive glass is demonstrated by femtosecond (fs) laser for lab-on-a-chip manufacture. True 3D hollow microstructures embedded in the glass are fabricated by the fs laser direct write followed by heat treatment and successive wet etching. A variety of microcomponents for a lab-on-a-chip device like a microfluidics, a microvalve, a microoptics, a microlaser, etc. are fabricated by using this technique. The fs laser direct write process is also applied for selective metallization of internal walls of the hollow microstructures embedded in the glass for electric control of movement of the micromechanical components in the lab-on-a-chip device.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 850: Symposium MM – Ultrafast Lasers for Materials Science , 2004 , MM1.3
Copyright
Copyright © Materials Research Society 2005

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References

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