Hostname: page-component-55f67697df-7l9ct Total loading time: 0 Render date: 2025-05-18T09:50:06.562Z Has data issue: false hasContentIssue false
  • English
  • Français

Using Convective Flow Splitting for the Direct Printing of Fine Copper Lines

Published online by Cambridge University Press:  10 February 2011

T. Cuk ,
S.M. Troian ,
C.M. Hong  and
S. Wagner
T. Cuk
Affiliation:
ELE Department, Princeton University, Princeton, NJ 08544, tanjacuk@princeton.edu
S.M. Troian
Affiliation:
CHE Department, Princeton University, Princeton, NJ 08544
S. Wagner
Affiliation:
ELE Department, Princeton University, Princeton, NJ 08544
Get access

Abstract

We have developed a technique for the printing of copper lines using solutions of a metal organic precursor, copper hexanoate. A 500-µm written liquid line is observed to split into two 100-µm wide lines. We observe further splitting into four parallel lines in experiments with written lines of copper hexanoate solution in chloroform. Surface profiles indicate that the thickness, width and number of lines formed are strongly dependent on the solution viscosity and volume per unit length deposited. From particle tracking visualization and surface profiling, we have found that evaporative cooling produces Marangoni convection patterns that accrete the solute along two key boundaries of flow

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 624: Symposium V – Materials Development for Direct Write Technologies , 2000 , 267
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

1 Deegan, R.D., Bakajin, O., Dupont, T.F., Huber, G., Nagel, S.R. and Witten, T.A., Nature 389, 827 (1997).Google Scholar
2 Deegan, R.D., Phys. Rev. E 61, 475 (2000).Google Scholar
3 Conway, J., Korns, H., and Fisch, M. R., Langmuir 13, pp. 426 (1997).Google Scholar
4 Maenosono, S., Dushkin, C. D., Saita, S., and Yamaguchi, Y., Langmuir 15, 957 (1999).Google Scholar
5 Adachi, E., Dimitrov, A. S., and Nagayama, K., Langmuir 11, 1057 (1995).Google Scholar
6 deGennes, P. G., Reviews of Modern Physics 57, 827 (1985).Google Scholar
7 Joanny, J.F. and deGennes, P.G., J. Chem. Phys. 81, 552 (1984).Google Scholar
8 Hong, C.M., Gleskova, H. and Wagner, S., Mat. Res. Soc. Symp. Proc. 471, 35 (1997).Google Scholar
9 Zhang, N. and Yang, W., Journal of Heat Transfer 104, 656 (1982).Google Scholar
10 Zhang, N. and Yang, W., Journal of Heat Transfer 105, 908 (1983).Google Scholar
11 Duh, J. C. and Yang, W., Numerical Heat Transfer, Part A 16, 129 (1989).Google Scholar