Hostname: page-component-76fb5796d-5g6vh Total loading time: 0 Render date: 2024-04-26T12:50:38.514Z Has data issue: false hasContentIssue false
  • English
  • Français

A Vibrational Technique for Stress Measurement in Films

Published online by Cambridge University Press:  16 February 2011

A. Jagota ,
S. Mazur  and
R. J. Farrisf
A. Jagota
Affiliation:
CR&D, Experimental Station, E.I. DuPont de Nemours & Co., Wilmington, Delaware 19880-0356.
S. Mazur
Affiliation:
CR&D, Experimental Station, E.I. DuPont de Nemours & Co., Wilmington, Delaware 19880-0356.
R. J. Farrisf
Affiliation:
Department of Polymer Science and Engineering, University of Massachusetts, Amherst, Massachusetts 01003.
Get access

Abstract

This paper presents a new technique for the measument of stress in films based on the classical theory of membrane vibrations. The specimens for vibrational analysis are prepared by removing a circular or square piece of the substrate far from any edge of the film (this operation preserves the state of stress in the film). The specimen is mechanically excited by random noise and its natural frequencies are peaks in the measured response of the membrane. The natural frequencies increase as the square root of stress in the film. The only material parameter needed to determine stress from the natural frequency is the density of the film. The technique has been used to measure stress in two different systems: urethane cured epoxies and silver films under different environmental conditions (temperature and humidity).

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 188: Symposium K – Thin Films: Stresses and Mechanical Properties II , 1990 , 35
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Campbell, D.S.,“Mechanical properties of thin films”, in Handbook of Thin Film Technology, Maissel, L.I. and Glang, R. (ed.), McGraw-Hill Book Co., (1970).Google Scholar
2. Karnezos, M.,(1986),“Effects of stress on the stability of x-ray masks”,Journal of Vacuum Science and Technology, B4,(1), 226.Google Scholar
3. Maden, M.A., Farris, R.J.,“Stress measurement in spin-coated polyimide films using time averaged holographic interferometry”, proceedings of MRS symposium on Electronic Packaging Materials Science, April 1989.Google Scholar
4. Maden, M.A., Tong, K., Farris, R.J., “Measurement of stresses in thin films using holographic interferometry: dependence on substrate and atmospheric conditions”, MRS symposium on Stresses in Thin Films: Measurement and Theory, MRS spring meeting (1990) (elsewhere in this volume).Google Scholar
5. Berry, B.S., Pritchet, ,(1990),“Internal stress and internal friction in thin-layer microelectronic materials”, Journal of Applied Physics, 67, (8), 3661–3668.Google Scholar
6. Jagota, A., Hui, C.Y.,“Mechanics of sintering thin films - I. Formulation and analytical results”, to appear in Mechanics of Materials.Google Scholar
7. Meirovitch, L.,Analytical methods in vibration, The MacMillan Company, (1967).Google Scholar
8. Gottlieb, H.P.W., Aebischer, H.A.,“Eigenfrequency shifts of a baffled circular membrane in a fluid medium”, Acustica 61, 4, 223–232, (1986).Google Scholar
9. Wah, T.,“Vibration of circular plates”, The Journal of the Acoustical Society of America, 34, 3, 275–281, (1962).Google Scholar