Hostname: page-component-848d4c4894-5nwft Total loading time: 0 Render date: 2024-06-08T04:45:39.047Z Has data issue: false hasContentIssue false
  • English
  • Français

Wedge Cleaving and Ultramicrotomy as Alternative TEM Sample Preparation Methods in Materials Science

Published online by Cambridge University Press:  16 February 2011

P. Ruterana ,
D. Laub  and
P-A. Buffat
P. Ruterana
Affiliation:
12M, The Federal Institute of Technology LausannePhB-Ecublens, Ch-1015 Lausanne, Switzerland
D. Laub
Affiliation:
12M, The Federal Institute of Technology LausannePhB-Ecublens, Ch-1015 Lausanne, Switzerland
P-A. Buffat
Affiliation:
12M, The Federal Institute of Technology LausannePhB-Ecublens, Ch-1015 Lausanne, Switzerland
Get access

Abstract

The use of two methods for preparation of TEM samples has been investigated. It has been possible to show the practical details of the wedge cleaving method and illustrate it with original results on III-V semiconductors and on metallic thin layers on Silicon. Chemical etching of AlGaAs in heterostructures was clearly observed and can further be quantified. Preferred oxidation of AlAs was shown to be important this can be a problem to a faithful interpretation of images from cross section samples prepared in more conventional ways. Efficient microtomy for use in materials science is still in the development stage, however we think to have found the best conditions for sectioning very soft metals like copper. We hope to decrease the compression in these materials by using lower angle diamond knives

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 199: Symposium W – Specimen Preparation for Transmission Electron Microscopy of Materials II , 1990 , 263
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Cullis, A.G and Chew, N. Ultrmicroscopy 23, 175(1987)Google Scholar
2. Hetherington, C.J.D. Mat. Res. Symp. Proc.vol 115, 143(1987)wedge MRS 1987Google Scholar
3. Ruterana, P., Ganière, J.D. and Buffat, P.A. J. Microsc. Spectrosc. Electron. 13, 421(1988)Google Scholar
4. Kakibayashi, H. and Nagata, F. Jpn. J. Appl. Phys. 24, 1905(1985)Google Scholar
5. Granvill, S.R., et al Phil. Mag. Lett. 58, 17(1889)Google Scholar
6. Thompson, G.E. and Wood, G.C. J. Microsc. Spetrosc. Electron. 12, 391(1897)Google Scholar
7. Jesior, J.C J. Ultrastruct. Res. 95, 210(1986)Google Scholar
8. Dinan, T.E., Landolt, D., Ruterana, P. and Buffat, P.A. in this workshop Spring MRS 1990 Google Scholar