A simple, cyanide-free, slightly acidic, chloride-based solution has been developed for the electrodeposition of Sn-0.7wt%Cu solder films. The solution contains only one additive (tri-ammonium citrate) other than the metal salts and is stable for more than 36 days. The optimum citrate concentration is 0.30 mol/L for 0.22 mol/L of SnCl2•2H2O. The addition of 0.003 mol/L of CuCl2•2H2O to this solution can produce near eutectic (Sn-0.7 wt% Cu) deposits, on Au, Ni or Cu substrates, at current densities of 10-12.5 mA/cm2. Plating rates are in the 20-27.5 μm/hr range at room temperature. Copper is evenly distributed (~0.7wt%Cu) through most of the thickness, with slightly higher Cu levels at the solder/Ni interface. After solder reflow at 260°C, two phases are present, Sn plus either Cu6Sn5 for Cu substrates or (Cu,Ni)6Sn5 for Ni substrates.