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D-5 Analysis of Shear Stress Distribution in Al (Cu) Interconnects Induced by Electromigration Based on Schmidt's Law and Studied by Synchrotron Polychromatic X-ray Microdiffraction

Published online by Cambridge University Press:  20 May 2016

K. Chen
Affiliation:
UCLA, CA
K. N. Tu
Affiliation:
UCLA, CA
N. Tamura
Affiliation:
Lawrence Berkeley National Laboratory, Berkeley, CA
B. C. Valek
Affiliation:
Lawrence Berkeley National Laboratory, Berkeley, CA

Abstract

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Type
DENVER X-RAY CONFERENCE
Copyright
Copyright © Cambridge University Press 2008

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