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D-5 Analysis of Shear Stress Distribution in Al (Cu) Interconnects Induced by Electromigration Based on Schmidt's Law and Studied by Synchrotron Polychromatic X-ray Microdiffraction

Published online by Cambridge University Press:  20 May 2016

K. Chen ,
K. N. Tu ,
N. Tamura  and
B. C. Valek
K. Chen
Affiliation:
UCLA, CA
K. N. Tu
Affiliation:
UCLA, CA
N. Tamura
Affiliation:
Lawrence Berkeley National Laboratory, Berkeley, CA
B. C. Valek
Affiliation:
Lawrence Berkeley National Laboratory, Berkeley, CA
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Abstract

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Type
DENVER X-RAY CONFERENCE
Information
Powder Diffraction , Volume 23 , Issue 2 , June 2008 , pp. 179
Copyright
Copyright © Cambridge University Press 2008

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