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INCORPORATING FIELD EFFECTS INTO THE DESIGN OF MODULAR PRODUCT FAMILIES

Published online by Cambridge University Press:  19 June 2023

Jan Kuechenhof ,
Markus C. Berschik ,
Julia Beibl ,
Iñigo Alonso Fernández ,
Kevin Otto ,
Dieter Krause  and
Ola Isaksson
Jan Kuechenhof*
Affiliation:
Hamburg University of Technology;
Markus C. Berschik
Affiliation:
Hamburg University of Technology;
Julia Beibl
Affiliation:
Hamburg University of Technology;
Iñigo Alonso Fernández
Affiliation:
Chalmers University of Technology;
Kevin Otto
Affiliation:
University of Melbourne
Dieter Krause
Affiliation:
Hamburg University of Technology;
Ola Isaksson
Affiliation:
Chalmers University of Technology;
*
Kuechenhof, Jan, Hamburg University of Technology, Germany, jan.kuechenhof@tuhh.de

Abstract

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With advancing digitalization, new technologies with more and more digital components make it necessary to integrate new components into current and future products. Sensors and actuators, such as motors, emit electromagnetic and thermal fields that can greatly affect product performance. Recent work has considered fields at the functional level using functional structures and at the system level using DSM. In this paper, the effects of fields on product architecture are investigated at the component level. Using an appropriate visualization, the impact of fields on the product structure is considered. Architectural guidelines are then used to develop suitable product structures. The methodological approach is then applied to a product family of vacuum cleaner robots. The overlaid field information helps to gain deeper insights into the product architecture. The approach is useful for representing alternative structures. The new mapping of functional and structural relationships by moving module boundaries against fields can help promote architectural innovation.

Keywords

Product familiesDesign for X (DfX)Design methods
Type
Article
Information
Proceedings of the Design Society , Volume 3: ICED23 , July 2023 , pp. 2275 - 2284
Creative Commons
Creative Common License - CCCreative Common License - BYCreative Common License - NCCreative Common License - ND
This is an Open Access article, distributed under the terms of the Creative Commons Attribution-NonCommercial-NoDerivatives licence (http://creativecommons.org/licenses/by-nc-nd/4.0/), which permits non-commercial re-use, distribution, and reproduction in any medium, provided the original work is unaltered and is properly cited. The written permission of Cambridge University Press must be obtained for commercial re-use or in order to create a derivative work.
Copyright
The Author(s), 2023. Published by Cambridge University Press

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